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S912ZVCA96F0MKH

NXP Semiconductors

S912ZVCA96F0MKH by NXP Semiconductors

MICROCONTROLLER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;

Median Price

$7.055

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 800 parts In-Stock

1+ parts

$9.110

100+ parts

$6.007

1k+ parts

$5.487

10k+ parts

-

800

$9.110

$6.007

$5.487

-

Verical

USA . 9,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.000

10k+ parts

-

9,600

-

-

$5.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,749 parts In-Stock

1+ parts

$7.438

100+ parts

-

1k+ parts

-

10k+ parts

-

1,749

$7.438

-

-

-

Vyrian

USA . 5,514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,514

-

-

-

-

Anansix

USA . 208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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208

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 898 parts In-Stock

1+ parts

$7.047

100+ parts

-

1k+ parts

-

10k+ parts

-

898

$7.047

-

-

-

Microchip USA

USA . 2,155 parts In-Stock

1+ parts

$15.306

100+ parts

-

1k+ parts

-

10k+ parts

-

2,155

$15.306

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

UNI Independent Distributors

Spain . 543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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543

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-

Technical Specifications

Microcontrollers S912ZVCA96F0MKH attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

NO

CPU Family:

S12Z

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of I/O Lines:

46

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

RAM Bytes:

8192

ROM Words:

98304

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

32 rpm

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

40 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN, I2C, SCI(2), SENT, SPI(2)

Peripherals:

COMPARATOR(2), POR, RTI, TIMER(12), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 8-Bit

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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