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PXAG37KFBD,157

NXP Semiconductors

PXAG37KFBD,157 by NXP Semiconductors

PXAG37KFBD,157 microcontroller from NXP Semiconductors features a 16-bit CPU with 32KB ROM and 512B RAM, ideal for industrial applications. It operates b/w -40 °C to 85 °C and supports surface mount technology in a flatpack design. With a max supply current of 80mA, it ensures efficient performance.

Median Price

$15.986

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$14.210

1k+ parts

$12.720

10k+ parts

$11.970

480

-

$14.210

$12.720

$11.970

Verical

USA . 480 parts In-Stock

1+ parts

-

100+ parts

$17.762

1k+ parts

$15.900

10k+ parts

$14.963

480

-

$17.762

$15.900

$14.963

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,005 parts In-Stock

1+ parts

$15.048

100+ parts

-

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2,005

$15.048

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Vyrian

USA . 4,174 parts In-Stock

1+ parts

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4,174

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Anansix

USA . 361 parts In-Stock

1+ parts

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361

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,715 parts In-Stock

1+ parts

$14.256

100+ parts

-

1k+ parts

-

10k+ parts

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3,715

$14.256

-

-

-

Microchip USA

USA . 262 parts In-Stock

1+ parts

$19.746

100+ parts

-

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262

$19.746

-

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AZTECH Wire

Italy . 867 parts In-Stock

1+ parts

$20.610

100+ parts

-

1k+ parts

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10k+ parts

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867

$20.610

-

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QUARKTWIN TECHNOLOGY LTD

USA . 16,870 parts In-Stock

1+ parts

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16,870

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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UNI Independent Distributors

Spain . 806 parts In-Stock

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806

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Overview

Unlock unparalleled performance with the PXAG37KFBD,157 microcontroller from NXP Semiconductors. Renowned for their innovation and reliability, NXP delivers a versatile solution perfect for industrial applications, offering exceptional durability in extreme conditions. With its energy-efficient design and robust functionality, this microcontroller ensures seamless integration into your projects, empowering you to enhance productivity and achieve operational excellence. Elevate your designs effortlessly!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures enhanced protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient space utilization on PCBs, making it ideal for compact and modern electronic designs.

Package Shape: SQUARE

The square package shape offers a consistent footprint which simplifies design and layout on printed circuit boards.

Bit Size: 16

With a 16-bit size, this microcontroller strikes a balance between performance and memory efficiency, providing adequate processing power for a plethora of applications.

Power Supplies (V): 3/5

The ability to operate at both 3V and 5V power supplies increases flexibility for integration in various systems and setups.

No. of Terminals: 44

44 terminals provide ample connectivity options, enabling a range of peripheral devices and communication interfaces.

Package Style (Meter): FLATPACK

The flatpack style is well-suited for automated assembly processes, enhancing production efficiency.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in industrial environments where high temperatures may be a concern.

CPU Family: XA

The XA CPU family is known for its robust architecture, making it a reliable choice for performance-critical applications.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C makes this microcontroller ideal for automotive and outdoor applications in extreme conditions.

Terminal Finish: TIN

Tin terminal finish provides good corrosion resistance and solderability, ensuring secure connections during assembly.

Terminal Position: QUAD

Quad terminal positioning allows for easy routing and placement on PCBs, facilitating simpler circuit designs.

ROM Words: 32768

With 32,768 ROM words, there is ample memory for storing firmware, enabling complex programming functionalities.

Maximum Time At Peak Reflow Temperature: 30 seconds

A peak reflow time of 30 seconds helps prevent damage during the soldering process, ensuring the longevity of the microcontroller.

Peak Reflow Temperature: 260 °C

The ability to withstand peak reflow temperatures of 260 °C ensures compatibility with modern soldering techniques.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this microcontroller is suitable for demanding applications in various harsh environments.

RAM Bytes: 512

512 bytes of RAM provide sufficient temporary storage for efficient operation and processing of tasks.

Technology: CMOS

CMOS technology offers low power dissipation and high noise immunity, making this microcontroller energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form ensures reliable solder joints and easier visual inspection post-assembly.

Maximum Supply Current: 80 mA

A maximum supply current of 80 mA allows for the execution of complex tasks while maintaining power efficiency.

ROM Programmability: UVPROM

Using UVPROM for ROM programmability allows for reprogramming, which is beneficial for prototypes and iterative designs.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch is ideal for high-density layouts, maximizing the number of input/output connections in limited space.

Speed: 30 rpm

With a speed of 30 rpm, this microcontroller can handle moderate-speed applications efficiently.

Technical Specifications

Microcontrollers PXAG37KFBD,157 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Bit Size:

16

CPU Family:

XA

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

32768

ROM Programmability:

UVPROM

Speed:

30 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PXAG37KFBD,157 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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