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PXAG30KFA,518

NXP Semiconductors

PXAG30KFA,518 by NXP Semiconductors

PXAG30KFA,518 by NXP Semiconductors is a 16-bit microcontroller with a 20-bit address bus width and 32 I/O lines. It is used in applications requiring PWM channels and features a square package shape with J bend terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Anansix

USA . 1,845 parts In-Stock

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Vyrian

USA . 1,601 parts In-Stock

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Digiode

USA . 827 parts In-Stock

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827

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Nova Conductors

Japan . 650 parts In-Stock

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650

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AZTECH Wire

Italy . 408 parts In-Stock

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$17.805

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408

$17.805

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Ampacity Inc.

Singapore . 866 parts In-Stock

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$25.000

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One Stop Electronics

USA . 599 parts In-Stock

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UNI Independent Distributors

Spain . 5,102 parts In-Stock

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Argo Parts USA

USA . 3,864 parts In-Stock

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Continental Prestige Electronics

USA . 2,831 parts In-Stock

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Corphita

USA . 2,771 parts In-Stock

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Aranea Global

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Overview

Experience the cutting-edge technology of the PXAG30KFA,518 microcontroller by NXP Semiconductors. As a leader in semiconductor manufacturing, NXP guarantees unparalleled quality and reliability. This powerful microcontroller opens up a world of possibilities with its versatile applications in various industries. Whether you're building smart appliances, automotive systems, or industrial machinery, the PXAG30KFA,518 offers unmatched value, efficiency, and performance. With its compact design and advanced features, this microcontroller is the perfect choice for your next project. Stay ahead of the curve with NXP Semiconductors and revolutionize the way you develop innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and resistance to impact, making the microcontroller suitable for harsh environments.

Surface Mount: YES

Surface mount technology provides easy and efficient PCB assembly, saving time and cost.

Address Bus Width: 20

A wide address bus width allows for efficient memory addressability and data processing.

Package Shape: SQUARE

Square package shape provides uniformity in design and ease of placement on the PCB.

Bit Size: 16

16-bit architecture enables faster processing and handling of data-intensive tasks.

No. of Terminals: 44

Higher number of terminals allow for more connectivity options and integration with external devices.

Package Style (Meter): CHIP CARRIER

Chip carrier style offers compact size and efficient heat dissipation, ideal for space-constrained applications.

Terminal Position: QUAD

Quad terminal position provides stability and reliable connection on the PCB.

Maximum Seated Height: 4.57 mm

Low seated height allows for slim and compact designs, suitable for portable and space-conscious applications.

Width: 16.5862 mm

Optimal width for easy placement and routing on the PCB, ensuring efficient circuit layout.

External Data Bus Width: 16

16-bit external data bus width enables faster data transfer between the microcontroller and external peripherals.

Length: 16.5862 mm

Balanced length for compatibility with standard PCB sizes, easy integration into existing designs.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller, ensuring optimal performance and functionality for various applications.

Technology: CMOS

CMOS technology offers low power consumption, extended battery life, and high-speed operation, making it cost-effective and reliable.

Terminal Form: J BEND

J bend terminal form provides secure soldering and robust connection, reducing the risk of signal loss or disconnection.

PWM Channels: YES

Pulse Width Modulation (PWM) support allows precise control over connected devices, essential for applications requiring variable speed or power control.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and maintenance, enhancing overall reliability and ease of assembly.

No. of I/O Lines: 32

A higher number of input/output lines offer versatile connectivity options, enabling interfacing with a wide range of external devices and sensors.

Technical Specifications

Microcontrollers PXAG30KFA,518 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

CAN ALSO OPERATE AT 2.7V MIN SUPPLY

Address Bus Width:

20

Bit Size:

16

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of I/O Lines:

32

No. of Terminals:

44

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

PXAG30KFA,518 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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