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PXAG30KFA

NXP Semiconductors

PXAG30KFA by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Median Price

$35.190

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,010 parts In-Stock

1+ parts

$35.190

100+ parts

$33.080

1k+ parts

$30.970

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6,010

$35.190

$33.080

$30.970

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Distributors (In-Stock)

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Digiode

USA . 1,272 parts In-Stock

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$35.378

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Vyrian

USA . 1,990 parts In-Stock

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Anansix

USA . 1,071 parts In-Stock

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Connector Distribution Corp

USA . 455 parts In-Stock

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455

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Right Parts Inc.

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455

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Chip Stock

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Beltway Electronics Company

USA . 58 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 13 parts In-Stock

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PC Components Company LLC

USA . 8 parts In-Stock

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Bristol Electronics

USA . 8 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,308 parts In-Stock

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$33.516

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$33.516

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A-Z Elektronik GmbH

Germany . 4,775 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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UNI Independent Distributors

Spain . 3,446 parts In-Stock

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Assy Fe

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Perfect Parts

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Kepictronics

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Technical Specifications

Microcontrollers PXAG30KFA attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

CAN ALSO OPERATE AT 2.7V MIN SUPPLY

Address Bus Width:

20

Bit Size:

16

CPU Family:

XA

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

Maximum Seated Height:

4.57 mm

Speed:

30 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.85 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

PXAG30KFA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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