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PT5010A0HN/C1

NXP Semiconductors

PT5010A0HN/C1 by NXP Semiconductors

PT5010A0HN/C1 by NXP Semiconductors is a telecom interface IC designed for efficient communication. It operates b/w -30 °C to 85 °C, features a compact 5mm x 5mm square package with 32 terminals, and requires a nominal voltage of 3V. Ideal for surface mount applications in telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,774 parts In-Stock

1+ parts

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1k+ parts

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3,774

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Vyrian

USA . 2,512 parts In-Stock

1+ parts

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1k+ parts

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2,512

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Anansix

USA . 1,039 parts In-Stock

1+ parts

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1,039

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 645 parts In-Stock

1+ parts

$891.000

100+ parts

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1k+ parts

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10k+ parts

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645

$891.000

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Corphita

USA . 4,817 parts In-Stock

1+ parts

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4,817

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UNI Independent Distributors

Spain . 1,769 parts In-Stock

1+ parts

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100+ parts

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1,769

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Overview

Elevate your telecommunications projects with the PT5010A0HN/C1 from NXP Semiconductors, a trusted leader in innovative technology. This compact interface IC delivers exceptional performance in a sleek design, ensuring reliability even in extreme conditions. Perfect for diverse applications, its robust features enhance connectivity and efficiency, giving you a competitive edge. Choose NXP for quality you can count on and unlock new possibilities for your next big idea!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection from environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount compatibility allows for easier and more efficient integration into modern electronic devices, supporting compact designs.

Package Shape: SQUARE

A square shape is often easier to fit in tight spaces, optimizing layout options on printed circuit boards (PCBs).

No. of Terminals: 32

Having 32 terminals facilitates a wide range of connections and functionalities, making this IC suitable for complex telecom applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This design promotes efficient heat dissipation and minimizes space requirements on the PCB, which is critical for high-performance applications.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature makes this IC suitable for applications in warmer environments without compromising performance.

Minimum Operating Temperature: -30 °C

The ability to function in low temperatures expands the range of environments in which this product can be used, increasing its versatility.

Terminal Position: QUAD

Quad terminal positioning can enhance connectivity options and drive performance in multi-function applications.

Maximum Seated Height: 1 mm

The low seated height allows for compact designs in devices, making it an ideal choice for modern, space-constrained applications.

Width: 5 mm

A compact width supports high-density PCB designs, enabling the creation of smaller electronic devices.

Length: 5 mm

This short length pairs well with a low profile, ensuring compatibility with tight spaces typically found in telecom devices.

Terminal Form: NO LEAD

The no-lead configuration reduces size while improving solderability and reliability in surface mount applications.

Telecom IC Type: TELECOM CIRCUIT

Specialized telecom circuit functionality ensures this IC is tailored for telecommunications, enhancing performance in relevant applications.

Nominal Supply Voltage: 3 V

Operating at a low supply voltage improves energy efficiency, a critical consideration for battery-powered or energy-sensitive devices.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density arrangements of components, making it suitable for space-constrained designs.

Technical Specifications

Other Function Telecom Interface ICs PT5010A0HN/C1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

PT5010A0HN/C1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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