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PSMN9R0-25YLC,115

NXP Semiconductors

PSMN9R0-25YLC,115 by NXP Semiconductors

PSMN9R0-25YLC,115 from NXP Semiconductors is an N-channel MOSFET ideal for power applications. It supports a max drain current of 46 A and power dissipation of 34 W, operating up to 175 °C. This surface-mount FET is perfect for efficient energy management in various devices.

Median Price

$0.382

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$0.382

1k+ parts

$0.317

10k+ parts

$0.283

4

-

$0.382

$0.317

$0.283

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,400 parts In-Stock

1+ parts

$0.134

100+ parts

-

1k+ parts

-

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2,400

$0.134

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-

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Vyrian

USA . 2,742 parts In-Stock

1+ parts

-

100+ parts

-

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2,742

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Anansix

USA . 828 parts In-Stock

1+ parts

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828

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,622 parts In-Stock

1+ parts

$0.127

100+ parts

-

1k+ parts

-

10k+ parts

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3,622

$0.127

-

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Component Stockers USA

USA . 5 parts In-Stock

1+ parts

$0.140

100+ parts

-

1k+ parts

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-

5

$0.140

-

-

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Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$6.026

100+ parts

-

1k+ parts

$5.785

10k+ parts

$5.785

50

$6.026

-

$5.785

$5.785

AZTECH Wire

Italy . 101 parts In-Stock

1+ parts

$18.670

100+ parts

-

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101

$18.670

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UNI Independent Distributors

Spain . 1,416 parts In-Stock

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1,416

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Overview

Elevate your design with the PSMN9R0-25YLC,115 from NXP Semiconductors—a leader in high-performance solutions. This N-channel power FET delivers exceptional efficiency and reliability, perfect for demanding applications like automotive and industrial systems. With superior thermal performance and a compact surface mount design, it enhances space-saving capabilities while ensuring robust operation. Choose NXP for quality you can trust and unlock your project’s potential today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance in terms of lower on-resistance and higher switching speeds, making this product suitable for high-efficiency applications.

Configuration: SINGLE

A single configuration simplifies circuit design and minimizes space requirements on the PCB, making it easier to integrate into compact devices.

Surface Mount: YES

Surface mount technology allows for reduced footprints on circuit boards and enables automated assembly processes, which are crucial for modern manufacturing.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer higher input impedance and can be turned off completely, providing excellent control over power consumption and heat generation.

Maximum Drain Current (Abs): 46 A

A maximum drain current of 46 A makes this FET suitable for high-power applications, ensuring robust performance under demanding conditions.

Maximum Power Dissipation (Abs): 34 W

With a power dissipation of 34 W, this FET can handle substantial heat without failing, making it ideal for power management in various electronic circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFETs are known for their high efficiency and fast switching capabilities, making this product ideal for applications such as power supplies and motor control.

Maximum Operating Temperature: 175 C

Operating at temperatures up to 175 °C ensures reliability in extreme environments, making this product suitable for automotive and industrial applications.

Terminal Finish: TIN

Tin finishes provide good solderability and corrosion resistance, enhancing the longevity and reliability of the device in various applications.

Maximum Time At Peak Reflow Temperature: 30 s

The relatively short peak reflow time ensures that the component can be safely soldered during assembly without degrading performance.

Peak Reflow Temperature: 260 C

A peak reflow temperature of 260 °C accommodates compatibility with most industrial soldering processes, enhancing production efficiency.

Technical Specifications

Power Field Effect Transistors (FET) PSMN9R0-25YLC,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

46 A

Maximum Drain Current (ID):

46 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PSMN9R0-25YLC,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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