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PSMN013-100XS,127

NXP Semiconductors

PSMN013-100XS,127 by NXP Semiconductors

PSMN013-100XS,127 by NXP Semiconductors is an N-channel enhancement mode FET ideal for power management applications. It supports a max drain current of 35.2 A and power dissipation of 48.4 W, operating up to 175 °C. Perfect for efficient energy conversion in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,180 parts In-Stock

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Anansix

USA . 2,359 parts In-Stock

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Digiode

USA . 2,140 parts In-Stock

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AZTECH Wire

Italy . 164 parts In-Stock

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$8.230

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One Stop Electronics

USA . 1,219 parts In-Stock

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$11.050

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Component Stockers USA

USA . 237 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,086 parts In-Stock

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Microchip USA

USA . 3,548 parts In-Stock

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Corphita

USA . 803 parts In-Stock

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UNI Independent Distributors

Spain . 510 parts In-Stock

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Overview

Unlock unmatched performance with the PSMN013-100XS,127 from NXP Semiconductors, a leader in innovative power solutions. This N-channel Power FET offers remarkable efficiency and reliability, making it ideal for demanding applications like automotive electronics and industrial systems. Experience superior thermal management and robust current handling that enhance your designs. Elevate your projects with a trusted partner dedicated to quality and excellence!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher electron mobility, which results in faster switching speeds and lower ON resistance, making them suitable for high-performance applications.

Configuration: SINGLE

Single configuration allows for simpler designs and easier integration into circuits, making it cost-effective and space-efficient for various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows the FET to operate in its off state until a gate voltage is applied, which leads to lower power consumption when idle, making it ideal for battery-powered devices.

Maximum Drain Current (Abs): 35.2 A

The ability to handle a maximum drain current of 35.2 A ensures robust performance under demanding conditions, allowing it to drive larger loads or be used in high-current applications.

Maximum Power Dissipation (Abs): 48.4 W

With a maximum power dissipation of 48.4 W, this FET can handle significant power levels without overheating, making it suitable for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, leading to improved efficiency and performance in a range of electronic applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C allows the transistor to function reliably in harsh environments, broadening its application range.

Technical Specifications

Power Field Effect Transistors (FET) PSMN013-100XS,127 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

35.2 A

Maximum Drain Current (ID):

35.2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Trade Compliance

PSMN013-100XS,127 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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