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PMPB40SNA,115

NXP Semiconductors

PMPB40SNA,115 by NXP Semiconductors

PMPB40SNA,115 by NXP Semiconductors is an N-channel enhancement mode FET designed for efficient power management. It supports a max drain current of 12.9 A and operates at temperatures up to 150 °C, making it ideal for high-performance applications. Its surface mount configuration ensures easy integration into compact designs.

Median Price

$0.734

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.721

1k+ parts

$0.599

10k+ parts

$0.534

1,000

-

$0.721

$0.599

$0.534

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.748

10k+ parts

$0.667

1,000

-

-

$0.748

$0.667

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,229 parts In-Stock

1+ parts

$0.288

100+ parts

-

1k+ parts

-

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3,229

$0.288

-

-

-

Vyrian

USA . 4,312 parts In-Stock

1+ parts

-

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4,312

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Anansix

USA . 1,333 parts In-Stock

1+ parts

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1,333

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DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.320

10k+ parts

-

1,000

-

-

$0.320

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 589 parts In-Stock

1+ parts

$0.258

100+ parts

-

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589

$0.258

-

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Corphita

USA . 4,603 parts In-Stock

1+ parts

$0.273

100+ parts

-

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4,603

$0.273

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Microchip USA

USA . 311 parts In-Stock

1+ parts

$2.080

100+ parts

-

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311

$2.080

-

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AZTECH Wire

Italy . 416 parts In-Stock

1+ parts

$19.220

100+ parts

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416

$19.220

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UNI Independent Distributors

Spain . 6,104 parts In-Stock

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6,104

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Overview

Unlock unparalleled performance with the PMPB40SNA,115 from NXP Semiconductors, a leader in innovative electronic solutions. This N-channel Power FET is engineered for efficiency and reliability, ideal for various applications such as power management and automotive systems. With its enhancement mode design and robust thermal handling, this component ensures peak operational excellence, delivering exceptional value and durability that empowers your projects to thrive.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility, which allows for lower on-resistance and improved efficiency, making this transistor suitable for high-speed switching applications.

Configuration: SINGLE

A single configuration simplifies circuit design and allows for adaptability in various applications, making it versatile for engineers.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, enabling efficient use of board space and reducing production costs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control and higher efficiency compared to depletion mode devices, making them ideal for low-power applications.

Maximum Drain Current (Abs) (ID): 12.9 A

With a maximum drain current of 12.9 A, this FET can handle substantial loads, making it suitable for high-power applications and reducing the risk of overheating.

Maximum Power Dissipation (Abs): 3.5 W

A power dissipation rating of 3.5 W indicates efficient heat management, allowing this FET to operate within safe limits even under heavy load, contributing to reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high input impedance and low output capacitance, resulting in faster switching speeds and lower power consumption, making it a modern choice for many applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows this FET to function reliably in high-temperature environments, enhancing its usability in rugged applications.

Terminal Finish: TIN

TIN terminal finish provides good solderability and resistance to corrosion, ensuring reliable connections in various environments and enhancing the longevity of the component.

Maximum Time At Peak Reflow Temperature (s): 30

With a tolerance of 30 seconds at peak reflow temperature, this FET is suitable for modern soldering techniques, ensuring it can withstand the assembly process without compromising its integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with lead-free soldering processes, making it a responsible choice for environmentally-friendly designs.

Technical Specifications

Power Field Effect Transistors (FET) PMPB40SNA,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

12.9 A

Maximum Drain Current (ID):

12.9 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PMPB40SNA,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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