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PMF77XN,115

NXP Semiconductors

PMF77XN,115 by NXP Semiconductors

PMF77XN,115 by NXP Semiconductors is an N-channel enhancement mode FET designed for efficient power management. It supports a max drain current of 1.63 A and operates up to 150 °C, making it ideal for compact electronic applications. Its surface mount configuration ensures easy integration into various circuits.

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3

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1k+

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Vyrian

USA . 5,716 parts In-Stock

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Digiode

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Anansix

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AZTECH Wire

Italy . 434 parts In-Stock

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One Stop Electronics

USA . 1,337 parts In-Stock

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Kepictronics

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Perfect Parts

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UNI Independent Distributors

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Corphita

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A-Z Elektronik GmbH

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Overview

Elevate your designs with the PMF77XN,115 from NXP Semiconductors—your go-to N-channel power FET for enhanced performance and reliability. Crafted by a leader in semiconductor innovation, this surface-mount transistor offers exceptional efficiency, making it ideal for diverse applications like power management and signal amplification. Experience lower energy consumption, superior heat resistance, and seamless integration that translates into high-quality, dependable solutions for your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher electron mobility, making them ideal for high-speed and efficient switching applications.

Configuration: SINGLE

A single configuration simplifies design and reduces the footprint in circuit boards, which is beneficial for compact electronic devices.

Surface Mount: YES

Surface mount capability allows for automated assembly, improving manufacturing efficiency and enabling designs that require space optimization.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for high input impedance and significant modulation of the drain current, making it suitable for a variety of analog and digital applications.

Maximum Drain Current (Abs) (ID): 1.63 A

With a maximum drain current of 1.63 A, this FET can handle substantial loads, making it suitable for power management tasks in circuits.

Maximum Power Dissipation (Abs): 0.35 W

A maximum power dissipation of 0.35 W indicates efficient thermal management, ensuring the device operates reliably without overheating during standard use.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high-density circuits with low power consumption, making this FET suitable for applications such as signal amplification and switching.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C ensures reliability in demanding environments, allowing the FET to be used in various industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) PMF77XN,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1.63 A

Maximum Drain Current (ID):

1.63 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

PMF77XN,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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