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PHD108NQ03LT/T3

NXP Semiconductors

PHD108NQ03LT/T3 by NXP Semiconductors

PHD108NQ03LT/T3 by NXP Semiconductors is a single N-channel MOSFET designed for high-performance applications. It supports a max drain current of 75 A, power dissipation of 187 W, and operates up to 175 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,116 parts In-Stock

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Digiode

USA . 849 parts In-Stock

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849

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Vyrian

USA . 123 parts In-Stock

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123

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One Stop Electronics

USA . 862 parts In-Stock

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$46.050

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862

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UNI Independent Distributors

Spain . 8,113 parts In-Stock

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Corphita

USA . 430 parts In-Stock

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430

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Overview

Elevate your power management with the PHD108NQ03LT/T3 from NXP Semiconductors, a leader in innovative semiconductor solutions. This high-quality N-channel FET delivers outstanding performance and reliability for diverse applications, from automotive to industrial systems. With its robust design and superior efficiency, it ensures optimal energy use and longevity, making it the smart choice for customers seeking performance without compromise. Experience the NXP advantage today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have higher efficiency and better performance in switching applications, making them suitable for high-speed and high-efficiency designs.

Configuration: SINGLE

Single configuration simplifies circuit design and minimizes the footprint on PCBs, which is ideal for space-constrained applications.

Surface Mount: YES

Surface mount technology offers advantages in manufacturing and assembly, allowing for smaller and lighter device packages that are easier to integrate in modern electronics.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better control over current flow and are less prone to leakage, making them suitable for low-power applications where efficiency is key.

Maximum Drain Current (Abs) (ID): 75 A

A maximum drain current of 75 A indicates the device can handle high load conditions, making it suitable for heavy-duty applications in power management and motor control.

Maximum Power Dissipation (Abs): 187 W

With a maximum power dissipation of 187 W, this FET can handle significant power levels without overheating, ensuring reliability in demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for higher switching speeds and reduced power consumption, making this FET ideal for modern high-efficiency circuits.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C indicates that this FET can perform reliably in harsh environments, expanding its usability in industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) PHD108NQ03LT/T3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

PHD108NQ03LT/T3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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