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PHB33NQ20T/T3

NXP Semiconductors

PHB33NQ20T/T3 by NXP Semiconductors

PHB33NQ20T/T3 from NXP Semiconductors is a single N-channel MOSFET designed for high-efficiency applications. It supports a max drain current of 32.7 A, power dissipation up to 230 W, and operates at temperatures up to 175 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,735 parts In-Stock

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Anansix

USA . 1,497 parts In-Stock

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Digiode

USA . 1,076 parts In-Stock

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One Stop Electronics

USA . 1,485 parts In-Stock

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$16.050

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$16.050

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Corphita

USA . 4,238 parts In-Stock

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UNI Independent Distributors

Spain . 3,326 parts In-Stock

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Overview

Unlock the power of innovation with the PHB33NQ20T/T3 from NXP Semiconductors—a trusted leader in advanced semiconductor solutions. This N-channel power FET delivers exceptional performance for high-efficiency applications, ensuring reliability and durability even in demanding environments. With a robust design that supports extensive power handling, it’s perfect for everything from industrial controls to consumer electronics. Experience unmatched quality and efficiency that elevate your projects to new heights!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and faster switching times, making them suitable for high-efficiency applications.

Configuration: SINGLE

A single configuration allows for straightforward circuit integration, maintaining simplicity and reducing potential points of failure.

Surface Mount: YES

Surface mount technology facilitates smaller board layouts and enables automated assembly, reducing manufacturing costs and saving space.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides higher performance characteristics and allows for control without significant leakage current when off.

Maximum Drain Current (Abs) (ID): 32.7 A

With a maximum drain current rating of 32.7 A, this FET can handle significant power loads, making it ideal for high-current applications.

Maximum Power Dissipation (Abs): 230 W

A high power dissipation rating of 230 W ensures that this FET can handle substantial energy without overheating, ensuring reliability in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching capabilities, making it ideal for digital circuits and high-speed applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET is suitable for harsh environments, ensuring performance and longevity.

Maximum Drain Current (ID): 32.7 A

Reiterating the significant maximum drain current, this FET is robust for applications that demand high current handling.

Technical Specifications

Power Field Effect Transistors (FET) PHB33NQ20T/T3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

32.7 A

Maximum Drain Current (ID):

32.7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

PHB33NQ20T/T3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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