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PCAL6416AHF

NXP Semiconductors

PCAL6416AHF by NXP Semiconductors

NXP Semiconductors' PCAL6416AHF is a 16-bit parallel I/O port with max supply voltage of 5.5V and min supply voltage of 1.65V, ideal for industrial applications. Featuring a square package style, it has 24 terminals in a chip carrier form factor with CMOS technology, suitable for various general-purpose peripheral IC designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Semtec, LLC

USA . 65,099 parts In-Stock

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Chip Stock

USA . 25,227 parts In-Stock

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Flip Electronics

USA . 6,232 parts In-Stock

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Digiode

USA . 1,099 parts In-Stock

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Sensible Micro Corp

USA . 934 parts In-Stock

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Anansix

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Vyrian

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Nova Conductors

Japan . 16 parts In-Stock

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J2 Sourcing AB

Sweden . 14 parts In-Stock

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AZTECH Wire

Italy . 767 parts In-Stock

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$7.656

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Semicontronic

India . 1,436 parts In-Stock

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$13.000

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$12.675

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$12.610

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One Stop Electronics

USA . 1,178 parts In-Stock

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Ampacity Inc.

Singapore . 210 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,905 parts In-Stock

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Corohmni

South Africa . 546 parts In-Stock

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UNI Independent Distributors

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A-Z Elektronik GmbH

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

USA . 3,748 parts In-Stock

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Lixinc

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Advanced Electronics

New Zealand . 550 parts In-Stock

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Bastille Electronics

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ChipstoGo Electronic ltd

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Overview

Experience the seamless integration and exceptional performance of the PCAL6416AHF by NXP Semiconductors, a leading manufacturer in the industry. This versatile Parallel I/O Port offers unparalleled reliability and efficiency for a wide range of applications, making it an indispensable component for your projects. With its innovative technology and advanced features, this product provides superior value and benefits to customers seeking top-notch quality and functionality. Elevate your designs with the PCAL6416AHF and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance of durability and cost-effectiveness.

Surface Mount: YES

Allows for easy and secure installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of input voltages, making it versatile.

Package Shape: SQUARE

Square shape makes it easy to integrate into various designs.

No. of Bits: 16

Offers a decent level of precision in data transfer.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial use.

Technology: CMOS

CMOS technology allows for low power consumption and high noise immunity.

Technical Specifications

Parallel I/O Ports PCAL6416AHF attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

No. of Timers:

0

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current:

200 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

PCAL6416AHF Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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