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PCA9541BS/03,118

NXP Semiconductors

PCA9541BS/03,118 by NXP Semiconductors

BUS CONTROLLER, I2C; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$1.425

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13,923 parts In-Stock

1+ parts

-

100+ parts

$1.400

1k+ parts

$1.160

10k+ parts

$1.040

13,923

-

$1.400

$1.160

$1.040

Verical

USA . 6,111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.450

10k+ parts

$1.300

6,111

-

-

$1.450

$1.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,548 parts In-Stock

1+ parts

$1.092

100+ parts

-

1k+ parts

-

10k+ parts

-

4,548

$1.092

-

-

-

Vyrian

USA . 3,429 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

-

3,429

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-

-

-

Anansix

USA . 1,845 parts In-Stock

1+ parts

-

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1k+ parts

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1,845

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-

-

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Semi Source

USA . 922 parts In-Stock

1+ parts

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-

1k+ parts

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922

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,015 parts In-Stock

1+ parts

$1.035

100+ parts

-

1k+ parts

-

10k+ parts

-

1,015

$1.035

-

-

-

Corohmni

South Africa . 2,588 parts In-Stock

1+ parts

$1.066

100+ parts

-

1k+ parts

-

10k+ parts

-

2,588

$1.066

-

-

-

Component Stockers USA

USA . 29,266 parts In-Stock

1+ parts

$1.170

100+ parts

$1.100

1k+ parts

$0.990

10k+ parts

$0.990

29,266

$1.170

$1.100

$0.990

$0.990

Microchip USA

USA . 271 parts In-Stock

1+ parts

$1.774

100+ parts

-

1k+ parts

-

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271

$1.774

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-

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AZTECH Wire

Italy . 307 parts In-Stock

1+ parts

$16.920

100+ parts

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10k+ parts

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307

$16.920

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UNI Independent Distributors

Spain . 1,656 parts In-Stock

1+ parts

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100+ parts

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1,656

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-

Technical Specifications

Bus Controllers PCA9541BS/03,118 attributes and parameters. Explore more Bus Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

PCA9541BS/03,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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