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PCA9535BS

NXP Semiconductors

PCA9535BS by NXP Semiconductors

NXP Semiconductors' PCA9535BS is a 16-bit parallel I/O port with 2 ports and 24 terminals. Operating b/w -40 to 85°C, it supports supply voltages of 2.3-5.5V for industrial applications. The chip carrier package has a compact square shape, making it suitable for space-constrained designs requiring general-purpose CMOS technology.

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Prism Electronics

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Connector Distribution Corp

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Right Parts Inc.

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ComSIT Distribution GmbH

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Digiode

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ACDS - Activité Composants Distribution Service

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Nova Conductors

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Flip Electronics

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Cyclops Electronics Ltd

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Semi Source

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First Choice Components Inc.

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One Stop Electronics

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AZTECH Wire

Italy . 496 parts In-Stock

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Ampacity Inc.

Singapore . 956 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 917 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic designs with the reliable PCA9535BS from NXP Semiconductors, a leading manufacturer known for top-quality components. This versatile Parallel I/O Ports device offers endless possibilities for various applications, providing customers with unmatched value and benefits. With 16 bits and a wide supply voltage range, this product ensures seamless performance in industrial settings while its compact design makes it easy to integrate into any project. Upgrade your projects today with the PCA9535BS and experience the superior quality and reliability that NXP Semiconductors is renowned for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and insulating properties.

Surface Mount: YES

Surface mount technology offers a more compact and efficient design for electronic devices.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with various power sources while providing a safe operating range.

No. of Bits: 16

Provides a sufficient number of bits for data transmission and processing capabilities.

Minimum Operating Temperature: -40 °C

Can function in extremely low-temperature environments, making it suitable for a wide range of applications.

No. of Ports: 2

Having multiple ports allows for increased connectivity and flexibility in connecting to other devices.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity.

Nominal Supply Voltage: 3 V

A commonly used voltage level that offers a balance between power consumption and performance.

Technical Specifications

Parallel I/O Ports PCA9535BS attributes and parameters. Explore more Parallel I/O Ports devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

16

No. of I/O Lines:

16

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Parallel IO Port

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

PCA9535BS Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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