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PCA9515ADP

NXP Semiconductors

PCA9515ADP by NXP Semiconductors

PCA9515ADP by NXP Semiconductors is a Line Transceiver with 2 functions, operating at 2.3-2.7V, suitable for industrial use. It has a max transmit delay of 130ns and receive delay of 130ns, with a small outline package style and Gull Wing terminal form.

Median Price

$0.720

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

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DF Sales Co.

USA . 3,086 parts In-Stock

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$0.720

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DF Sales Co.

USA . 3,086 parts In-Stock

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$0.720

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Freelance Electronics

USA . 200 parts In-Stock

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$1.239

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$1.301

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$1.227

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Chip Stock

USA . 502,622 parts In-Stock

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Cyclops Electronics Ltd

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Digiode

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Connector Distribution Corp

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Right Parts Inc.

USA . 3,147 parts In-Stock

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Anansix

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Component Sense

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Flip Electronics

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Classic Components Corporation

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ComSIT Distribution GmbH

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Bristol Electronics

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Vyrian

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Legend Electronics Inc.

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Nova Conductors

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Prism Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Atlantic Semiconductor

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One Stop Electronics

USA . 1,314 parts In-Stock

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$4.500

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Aztec Data Supply Inc.

USA . 155 parts In-Stock

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$9.230

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AZTECH Wire

Italy . 242 parts In-Stock

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$9.359

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Corohmni

South Africa . 193 parts In-Stock

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Semicontronic

India . 786 parts In-Stock

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$24.862

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Ampacity Inc.

Singapore . 600 parts In-Stock

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Continental Prestige Electronics

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S.R.D Solutions

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Advanced Electronics

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ChipstoGo Electronic ltd

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Corphita

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Argo Parts USA

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GreenTree Electronics

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Overview

Unlock seamless communication and connectivity with the PCA9515ADP by NXP Semiconductors. Crafted with precision and reliability, this line driver and receiver offers unmatched quality for a wide range of applications. Whether you're looking to enhance your industrial systems or streamline data transmission, this product delivers exceptional performance. With its advanced technology and innovative design, the PCA9515ADP ensures a smooth operation and optimal functionality. Elevate your projects with NXP Semiconductors and experience the value and benefits this product brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, making it suitable for rugged environments.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 2.7 V

Operates efficiently within a limited voltage range, ensuring stable performance and preventing damage from high supply voltages.

No. of Functions: 2

Offers multiple functions in a single device, providing cost savings and simplifying circuit design.

Package Shape: SQUARE

Optimal shape for maximizing space efficiency on PCBs and facilitating easy integration into various systems.

Maximum Transmit Delay: 130 ns

Provides fast data transmission, reducing latency and improving overall system performance.

Power Supplies (V): 2.5/3.3

Compatible with commonly used power supply voltages, ensuring versatility and easy integration into different applications.

No. of Terminals: 8

Sufficient number of terminals for connecting to external devices and components, enabling versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design for space-saving installation, ideal for applications with limited PCB real estate.

Minimum Supply Voltage: 2.3 V

Operates reliably even at lower supply voltages, ensuring consistent performance in a variety of operating conditions.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, making it suitable for industrial applications where temperature fluctuations may occur.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments, ensuring reliability and performance in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides a reliable and durable terminal finish, ensuring long-term connectivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positions for versatile mounting options and ease of connection in various circuit configurations.

Maximum Seated Height: 1.1 mm

Low-profile design for compact installation, suitable for space-constrained applications.

Width: 3 mm

Narrow width for efficient use of PCB space, making it ideal for compact electronic devices.

Receiver No. of Bits: 2

Provides two receiving channels for versatile data reception capabilities and improved communication efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for easy and reliable soldering during assembly, ensuring proper connection and long-term reliability.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during soldering processes, ensuring a secure and durable connection.

Length: 3 mm

Compact length for efficient use of space on PCBs, suitable for applications where size constraints are a concern.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature ranges, ensuring reliability and performance in harsh operating environments.

Maximum Receive Delay: 130 ns

Provides fast reception of data, reducing response time and improving overall system efficiency.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull-wing terminals for easy surface mounting and reliable connection, facilitating efficient assembly and secure PCB integration.

Input Characteristics: STANDARD

Standardized input characteristics for compatibility with a wide range of devices, ensuring easy integration into various systems.

Nominal Supply Voltage: 2.5 V

Operates at a commonly used supply voltage, ensuring compatibility and ease of integration into existing systems.

Terminal Pitch: 0.65 mm

Fine terminal pitch for high-density mounting, suitable for applications requiring a compact design and efficient use of PCB space.

Driver No. of Bits: 2

Provides two transmitting channels for versatile data transmission capabilities and improved communication efficiency.

Interface IC Type: LINE TRANSCEIVER

Equipped with a line transceiver interface for reliable data communication and seamless integration into communication networks.

Technical Specifications

Line Drivers & Receivers PCA9515ADP attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

130 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

130 ns

Width:

3 mm

Trade Compliance

PCA9515ADP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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