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PCA9515ADP/G,118

NXP Semiconductors

PCA9515ADP/G,118 by NXP Semiconductors

NXP Semiconductors' PCA9515ADP/G,118 is a Line Transceiver IC with 2 functions. It operates at supply voltages of 2.3-2.7V and has a max transmit delay of 130ns. Ideal for industrial applications requiring reliable communication over short distances.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,310 parts In-Stock

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Digiode

USA . 1,200 parts In-Stock

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Bristol Electronics

USA . 1,050 parts In-Stock

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Vyrian

USA . 812 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,102 parts In-Stock

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$8.270

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$8.270

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Advanced Electronics

New Zealand . 600 parts In-Stock

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$8.879

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$8.435

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$8.435

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600

$8.879

$8.435

$8.435

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Corohmni

South Africa . 215 parts In-Stock

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$10.027

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215

$10.027

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One Stop Electronics

USA . 695 parts In-Stock

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$13.500

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695

$13.500

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AZTECH Wire

Italy . 701 parts In-Stock

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$15.291

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701

$15.291

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Ampacity Inc.

Singapore . 1,394 parts In-Stock

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$17.500

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$17.500

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Semicontronic

India . 1,534 parts In-Stock

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$19.500

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$19.012

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$18.915

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1,534

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$18.915

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UNI Independent Distributors

Spain . 5,901 parts In-Stock

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Continental Prestige Electronics

USA . 3,568 parts In-Stock

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Corphita

USA . 2,673 parts In-Stock

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Argo Parts USA

USA . 992 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Overview

Experience the unparalleled quality and reliability of NXP Semiconductors with the PCA9515ADP/G,118 line driver & receiver. This innovative product is designed to provide seamless communication in a wide range of applications, offering customers exceptional value and performance. With its advanced technology and industrial-grade temperature tolerance, the PCA9515ADP/G,118 delivers unmatched reliability and efficiency, making it the ideal choice for your next project. Trust NXP Semiconductors to deliver cutting-edge solutions that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 2.7 V

With a maximum supply voltage of 2.7V, this product is compatible with a wide range of power sources and can handle varying voltage inputs.

No. of Functions: 2

This product offers dual functions, providing versatility and flexibility for different communication requirements.

Package Shape: SQUARE

The square shape of the package allows for efficient use of board space and easy alignment during installation.

Maximum Transmit Delay: 130 ns

This low transmit delay ensures fast and efficient data transmission, making it a reliable choice for real-time communication systems.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options allows for compatibility with different systems and voltage requirements.

No. of Terminals: 8

With 8 terminals, this product provides sufficient connectivity options for various input and output connections.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and sleek design of the package ensures space-saving and easy integration into compact electronic devices.

Minimum Supply Voltage: 2.3 V

The low minimum supply voltage requirement allows for operation in systems with limited power sources, increasing versatility.

Technical Specifications

Line Drivers & Receivers PCA9515ADP/G,118 attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

130 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

130 ns

Width:

3 mm

Trade Compliance

PCA9515ADP/G,118 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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