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PCA9515ADP-T

NXP Semiconductors

PCA9515ADP-T by NXP Semiconductors

PCA9515ADP-T by NXP Semiconductors is a Line Transceiver IC with 2 functions, operating at 2.3-2.7V, suitable for industrial applications. It has a transmit delay of 130ns, receive delay of 130ns, and operates in the temperature range of -40 to 85°C.

Median Price

$1.200

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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DF Sales Co.

USA . 2,200 parts In-Stock

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DF Sales Co.

USA . 2,200 parts In-Stock

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Digiode

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Next Level Components, LLC

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Bristol Electronics

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Infinite Electronics LLP

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Anansix

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Sunrise Surplus Inc.

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Vyrian

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Nova Conductors

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One Stop Electronics

USA . 1,548 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,496 parts In-Stock

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Corohmni

South Africa . 157 parts In-Stock

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AZTECH Wire

Italy . 627 parts In-Stock

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Ampacity Inc.

Singapore . 1,584 parts In-Stock

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iodParts Technologies Inc.

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Continental Prestige Electronics

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Metaverse IC Inc.

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Corphita

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Argo Parts USA

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Overview

Elevate your electronic designs with the PCA9515ADP-T from NXP Semiconductors. Known for their superior quality and reliability, NXP Semiconductors delivers top-of-the-line Line Drivers & Receivers like no other. This powerful device offers seamless connectivity, smooth data transmission, and enhanced performance for a wide range of applications. Say goodbye to technical glitches and hello to streamlined operations with the PCA9515ADP-T - your ultimate solution for efficient and effective communication in any project. Trust NXP Semiconductors to bring innovation and excellence to your doorstep.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable, the product is easy to integrate into circuit boards, saving space and allowing for efficient assembly.

Maximum Supply Voltage: 2.7 V

The maximum supply voltage of 2.7V ensures safe operation and protection of the device from potential damage due to overvoltage.

No. of Functions: 2

With multiple functions integrated into one device, it offers versatility and cost-effectiveness in handling different tasks.

Package Shape: SQUARE

The square package shape provides stability and ease of mounting, ensuring a secure fit within the circuit design.

Maximum Transmit Delay: 130 ns

The low transmit delay of 130ns facilitates fast data transmission, making the product suitable for applications requiring quick response times.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages (2.5V and 3.3V) provides flexibility in compatibility with various systems and devices.

No. of Terminals: 8

Having 8 terminals allows for efficient connectivity and signal routing, enhancing the overall performance and reliability of the product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style makes the product space-saving and suitable for compact applications where size is a constraint.

Minimum Supply Voltage: 2.3 V

The minimum supply voltage of 2.3V ensures reliable operation even under low voltage conditions, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the product can withstand elevated temperature environments, improving its reliability and durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to function effectively in cold environments, making it suitable for diverse operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides a reliable and corrosion-resistant connection, ensuring long-term performance and stability.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting orientations, providing flexibility in circuit board layout and design.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm minimizes space requirements and allows for compact assembly, ideal for applications with size constraints.

Width: 3 mm

The narrow width of 3mm enables easy integration into tight spaces, offering flexibility in design and layout options.

Receiver No. of Bits: 2

With 2 bits for the receiver, the product can handle multiple data streams efficiently, enabling reliable communication and data transfer.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure soldering and robust connections during assembly, enhancing the product's reliability.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the product can withstand harsh environmental conditions and operate reliably in demanding settings.

Maximum Receive Delay: 130 ns

The low maximum receive delay of 130ns ensures quick processing of incoming data, reducing latency and improving overall system performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, making the product energy-efficient and versatile.

Terminal Form: GULL WING

The gull wing terminal form provides a reliable connection and ease of soldering during assembly, ensuring secure and stable electrical contacts.

Input Characteristics: STANDARD

The standard input characteristics ensure compatibility with common signal levels and devices, making the product easy to integrate into existing systems.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V provides a stable operating point for the device, optimizing performance and ensuring consistent functionality.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for dense packing and efficient use of space on the circuit board, ideal for compact designs.

Driver No. of Bits: 2

With 2 bits for the driver, the product can send multiple data streams effectively, enhancing communication speed and reliability in data transmission.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, the product can handle both transmitting and receiving data over communication lines, making it a versatile and essential component in networking and communication systems.

Technical Specifications

Line Drivers & Receivers PCA9515ADP-T attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

130 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

130 ns

Width:

3 mm

Trade Compliance

PCA9515ADP-T Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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