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PCA9509D,118

NXP Semiconductors

PCA9509D,118 by NXP Semiconductors

PCA9509D,118 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 3-5.5V. It operates in industrial temperatures (-40 to 85°C) and has a compact square package style (4.9mm x 3.9mm). Ideal for applications requiring small outline surface-mount ICs with dual terminals.

Median Price

$1.208

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 157 parts In-Stock

1+ parts

$1.208

100+ parts

$1.135

1k+ parts

$1.026

10k+ parts

-

157

$1.208

$1.135

$1.026

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.000

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10

$1.000

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Digiode

USA . 2,473 parts In-Stock

1+ parts

$1.147

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2,473

$1.147

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Vyrian

USA . 2,780 parts In-Stock

1+ parts

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2,780

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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2,500

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Anansix

USA . 828 parts In-Stock

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828

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Distributors (Availability)

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Netroflash

USA . 50 parts In-Stock

1+ parts

$1.000

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50

$1.000

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Ampacity Inc.

Singapore . 157 parts In-Stock

1+ parts

$1.030

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157

$1.030

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Corphita

USA . 3,696 parts In-Stock

1+ parts

$1.087

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3,696

$1.087

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AZTECH Wire

Italy . 771 parts In-Stock

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$16.145

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771

$16.145

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Microchip USA

USA . 2,304 parts In-Stock

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$24.335

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2,304

$24.335

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,649 parts In-Stock

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5,649

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UNI Independent Distributors

Spain . 5,036 parts In-Stock

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5,036

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Perfect Parts

USA . 1,042 parts In-Stock

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1,042

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Overview

Enhance your electronic designs with the PCA9509D,118 by NXP Semiconductors. Known for their top-notch quality, NXP Semiconductors delivers reliable performance and innovative technology. This Interface Circuit IC offers a wide range of applications, making it a versatile choice for various projects. With a compact design and industrial-grade temperature range, this product provides exceptional value and benefits to customers seeking high-quality components for their electronics projects. Experience the advantages of NXP Semiconductors with the PCA9509D,118.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and resistance to environmental factors, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount design allows for easy and efficient integration onto circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in different power supply configurations, ensuring stable operation within the specified limits.

Package Shape: SQUARE

Square package shape facilitates proper alignment and orientation during installation, reducing the chance of misalignment and ensuring reliable performance.

Power Supplies (V): 1/4.5, 3.3/5

Support for multiple power supply configurations allows for compatibility with a wide range of systems, enhancing versatility and ease of integration.

No. of Terminals: 8

A sufficient number of terminals provide ample connectivity options, enabling seamless communication with other components in the system.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in conserving space on the circuit board, making it suitable for compact designs where size is a critical factor.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with systems that operate at lower voltages, expanding the range of applications for this product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows the product to function reliably in harsh environments with elevated temperatures, improving overall durability.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures enables the product to perform effectively in extreme cold conditions, enhancing its suitability for various industrial settings.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable performance.

Terminal Position: DUAL

Dual terminal position enhances connection stability and reduces the risk of signal interference, improving overall signal integrity and system performance.

Maximum Seated Height: 1.75 mm

Low maximum seated height helps in minimizing the overall profile of the product, making it suitable for applications where space constraints are a concern.

Width: 3.9 mm

Narrow width dimension allows for efficient placement and routing on the circuit board, contributing to a more streamlined and compact layout.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures proper soldering and assembly processes, leading to reliable connections and long-term operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables robust solder joints and ensures the product can withstand high-temperature assembly processes without compromising performance.

Length: 4.9 mm

Compact length dimension contributes to space-saving design and efficient utilization of board real estate, enhancing overall system integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating indicates the product's suitability for operation in demanding industrial environments, providing robust and reliable performance under challenging conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and suitable for applications where power efficiency is crucial.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure connections, ensuring reliability and ease of assembly during manufacturing processes.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V allows for consistent and reliable operation, meeting the power requirements of the product for optimal performance.

Terminal Pitch: 1.27 mm

Small terminal pitch enables closer spacing of terminals on the package, enhancing signal integrity and reducing the risk of signal interference for improved overall performance.

Interface IC Type: INTERFACE CIRCUIT

Dedicated interface circuit type ensures efficient and accurate communication between different components, enabling seamless data transfer and interoperability within the system.

Technical Specifications

Other Function Interface ICs PCA9509D,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/4.5,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

PCA9509D,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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