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PCA8581T

NXP Semiconductors

PCA8581T by NXP Semiconductors

EEPROM; Temperature Grade: OTHER; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V;

Median Price

$4.925

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TEDSS.com

USA . 630 parts In-Stock

1+ parts

$2.500

100+ parts

$1.680

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630

$2.500

$1.680

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Forefront Electronics and Design

USA . 60 parts In-Stock

1+ parts

$7.350

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60

$7.350

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Digiode

USA . 4,834 parts In-Stock

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Vyrian

USA . 2,043 parts In-Stock

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2,043

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R&J Components

USA . 1,951 parts In-Stock

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Anansix

USA . 1,935 parts In-Stock

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1,935

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Pegasus Components GmbH

Germany . 50 parts In-Stock

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50

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LWI Electronics Inc

India . 15 parts In-Stock

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15

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NAC Semi

USA . 8 parts In-Stock

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8

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Huijzer Components

Netherlands . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,507 parts In-Stock

1+ parts

$14.000

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1,507

$14.000

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Kepictronics

USA . 6,177 parts In-Stock

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UNI Independent Distributors

Spain . 1,708 parts In-Stock

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Corphita

USA . 839 parts In-Stock

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Technical Specifications

EEPROM PCA8581T attributes and parameters. Explore more EEPROM devices from NXP Semiconductors

Specs

Additional Features:

10 YEAR OF DATA RETENTION

Maximum Clock Frequency (fCLK):

.1 MHz

Minimum Data Retention Time:

10

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Organization:

128X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Programming Voltage (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

10 ms

Trade Compliance

PCA8581T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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