Loading...

PCA8582BT

NXP Semiconductors

PCA8582BT by NXP Semiconductors

PCA8582BT by NXP Semiconductors is a 2048-bit EEPROM with a 5V supply, designed for automotive applications. It features a synchronous I2C interface and operates in temperatures from -40 °C to 125 °C. This compact, dual-terminal device supports fast write cycles of 40 ms.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,283

-

-

-

-

Digiode

USA . 2,035 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,035

-

-

-

-

Anansix

USA . 1,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,941

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,589 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,589

$5.000

-

-

-

UNI Independent Distributors

Spain . 5,351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,351

-

-

-

-

Corphita

USA . 3,551 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,551

-

-

-

-

Overview

Unlock the power of reliable data storage with the PCA8582BT from NXP Semiconductors, a leader in innovation and quality. This high-performance EEPROM guarantees durability across extreme temperatures, making it ideal for automotive applications. Enjoy seamless integration thanks to its compact design and I2C interface, ensuring efficient communication. Experience enhanced security, longevity, and peace of mind as you trust this robust solution for your critical projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good durability and resistance to environmental stress, making the EEPROM suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern PCBs, making the product ideal for applications with space constraints.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout on printed circuit boards, enhancing compatibility with standard components.

Operating Mode: SYNCHRONOUS

Synchronous operation provides faster data transfer rates, improving performance for applications requiring quick access to stored data.

Nominal Supply Voltage / Vsup: 5 V

This standard voltage level ensures compatibility with a wide range of systems and simplifies integration into existing designs.

No. of Terminals: 16

A 16-terminal configuration offers a good balance of connectivity and ease of use in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style promotes a compact and lightweight design, ideal for space-sensitive applications.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliability and performance in demanding automotive and industrial environments.

Organization: 256X8

This configuration allows for efficient data organization and processing, making it suitable for applications with specific data storage needs.

Minimum Operating Temperature: -40 °C

Wide operational temperature range allows the EEPROM to function in extreme conditions, ensuring reliability in harsh environments.

Terminal Position: DUAL

Dual terminal position provides support for a variety of mounting options, enhancing design flexibility.

Maximum Seated Height: 2.65 mm

Low profile height enhances PCB stack-up optimization and is suitable for compact electronic designs.

Maximum Clock Frequency (fCLK): 0.1 MHz

While moderate, this speed is sufficient for many applications, ensuring that the EEPROM meets standard performance requirements.

Width: 7.5 mm

The suitable width allows for efficient PCB design and compatibility with a variety of layouts.

Minimum Supply Voltage (Vsup): 4.5 V

Provides design flexibility with a lower supply voltage requirement, suitable for battery-operated devices.

Length: 10.3 mm

Compact length enhances space efficiency on PCBs, making it ideal for modern electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive grade components are designed for reliability in the automotive industry, ensuring safety and durability.

Technology: CMOS

CMOS technology results in lower power consumption, improving energy efficiency for battery-powered and portable devices.

Parallel or Serial: SERIAL

Serial communication reduces pin count and simplifies PCB design, enabling compact arrangements.

Terminal Form: GULL WING

Gull wing terminals improve solderability and mechanical stability, ensuring reliable connections.

No. of Words: 256 words

Offers a sufficient amount of storage for a variety of applications, from simple data storage to configuration settings.

Memory Width: 8

An 8-bit memory width allows for efficient handling of data and simplifies interfacing with microcontrollers.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates easier soldering and compatibility with existing boards, enhancing design convenience.

No. of Words Code: 256

Flexible addressing with 256 words allows for straightforward data management and retrieval.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for slightly higher operational voltages, providing safety margins for varied power supply applications.

Serial Bus Type: I2C

I2C compatibility enables easy integration into multi-device systems, Streamlining communications within complex applications.

Maximum Write Cycle Time (tWC): 40 ms

A reasonable write cycle time ensures that data can be updated efficiently in most applications, maintaining system responsiveness.

Memory Density: 2048 bit

2048 bits of memory density offers sufficient storage for numerous useful applications, including firmware storage and non-volatile settings.

Memory IC Type: EEPROM

As a non-volatile memory type, EEPROM is perfect for applications requiring data retention without power, such as configuration settings.

Technical Specifications

EEPROM PCA8582BT attributes and parameters. Explore more EEPROM devices from NXP Semiconductors

Specs

Additional Features:

I2C BUS INTERFACE; FMAX IS 100KHZ

Maximum Clock Frequency (fCLK):

.1 MHz

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

16

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Maximum Write Cycle Time (tWC):

40 ms

Trade Compliance

PCA8582BT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20