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P87LPC762BDH

NXP Semiconductors

P87LPC762BDH by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$1.307

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,478 parts In-Stock

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Vyrian

USA . 1,964 parts In-Stock

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Digiode

USA . 1,874 parts In-Stock

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MRC Electronics

USA . 1,147 parts In-Stock

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ComSIT Distribution GmbH

Germany . 708 parts In-Stock

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Zilex Electronics Inc.

Canada . 365 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Bristol Electronics

USA . 186 parts In-Stock

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LWI Electronics Inc

India . 3 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 973 parts In-Stock

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$27.000

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Perfect Parts

USA . 8,960 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,066 parts In-Stock

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Corphita

USA . 4,961 parts In-Stock

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UNI Independent Distributors

Spain . 1,657 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Technical Specifications

Microcontrollers P87LPC762BDH attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

CAN ALSO OPERATE AT 2.7V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

18

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

OTPROM

Maximum Seated Height:

1.1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

P87LPC762BDH Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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