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P87LPC760BDH

NXP Semiconductors

P87LPC760BDH by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$16.060

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 23,809 parts In-Stock

1+ parts

$26.150

100+ parts

$24.580

1k+ parts

$23.010

10k+ parts

-

23,809

$26.150

$24.580

$23.010

-

DigiKey

USA . 2,872 parts In-Stock

1+ parts

-

100+ parts

$5.970

1k+ parts

$5.970

10k+ parts

$5.970

2,872

-

$5.970

$5.970

$5.970

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,647 parts In-Stock

1+ parts

$5.970

100+ parts

-

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-

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3,647

$5.970

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-

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Digiode

USA . 4,445 parts In-Stock

1+ parts

$17.176

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-

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4,445

$17.176

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DigiKey Marketplace

USA . 23,838 parts In-Stock

1+ parts

-

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23,838

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Anansix

USA . 1,452 parts In-Stock

1+ parts

-

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1,452

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Infinite Electronics LLP

India . 373 parts In-Stock

1+ parts

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373

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,417 parts In-Stock

1+ parts

$16.272

100+ parts

-

1k+ parts

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2,417

$16.272

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QUARKTWIN TECHNOLOGY LTD

USA . 20,198 parts In-Stock

1+ parts

-

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20,198

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A-Z Elektronik GmbH

Germany . 6,954 parts In-Stock

1+ parts

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6,954

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UNI Independent Distributors

Spain . 5,179 parts In-Stock

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5,179

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Infinite Electronics LLP (Excess)

. 377 parts In-Stock

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377

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Perfect Parts

USA . 132 parts In-Stock

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132

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Kepictronics

USA . 99 parts In-Stock

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99

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Technical Specifications

Microcontrollers P87LPC760BDH attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 2.7V MIN SUPPLY

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

12

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

OTPROM

Maximum Seated Height:

1.1 mm

Speed:

20 rpm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

P87LPC760BDH Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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