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P87LPC762BN

NXP Semiconductors

P87LPC762BN by NXP Semiconductors

NXP Semiconductors' P87LPC762BN is an 8-bit microcontroller with a max clock frequency of 20 MHz. It operates b/w 0-70°C, has 128 bytes of RAM, and ROM words of 2048. Widely used in commercial applications requiring a microcontroller with 18 I/O lines and OTPROM programmability.

Median Price

$26.150

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 2,363 parts In-Stock

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$26.150

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$24.580

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$23.010

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Digiode

USA . 2,474 parts In-Stock

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$19.200

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Vyrian

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Cyclops Electronics Ltd

UK . 882 parts In-Stock

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ComSIT Distribution GmbH

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Nova Conductors

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Prism Electronics

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Microfarads

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LIBRA Elektronik GmbH

Germany . 11 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 3,404 parts In-Stock

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$2.340

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$1.540

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Component Stockers USA

USA . 4,491 parts In-Stock

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$6.920

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$6.570

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$6.360

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Corphita

USA . 616 parts In-Stock

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Corohmni

South Africa . 104 parts In-Stock

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Lixinc

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Argo Parts USA

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Robosynatics

Brazil . 1,541 parts In-Stock

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$69.672

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Lucentia Tech

USA . 1,541 parts In-Stock

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$71.124

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Metaverse IC Inc.

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GreenTree Electronics

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Kepictronics

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Aranea Global

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Overview

Unleash the power of innovation with the NXP Semiconductors P87LPC762BN microcontroller. Designed with precision and expertise, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. From smart home devices to industrial automation, this versatile microcontroller delivers seamless functionality and efficiency. Elevate your projects to new heights with the P87LPC762BN and experience the value and benefits that only NXP Semiconductors can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller.

Maximum Supply Voltage: 6 V

Allows flexibility in power supply options and compatibility with different systems.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement in electronic circuits.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost efficiency.

Power Supplies (V): 3/5

Supports multiple power supply options for increased versatility.

No. of Terminals: 20

Sufficient number of terminals for connecting to various external components and peripherals.

Package Style (Meter): IN-LINE

In-line package style allows for space-saving and efficient PCB layout.

Minimum Supply Voltage: 4 V

Lower minimum supply voltage allows for operation in lower power applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

CPU Family: 8051

Proven 8051 architecture provides familiarity and ease of development for engineers.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish ensures good conductivity and corrosion resistance for terminals.

Terminal Position: DUAL

Dual terminal position allows for secure and stable connection in the circuit.

ROM Words: 2048

Sufficient ROM capacity for storing program code and data.

Maximum Seated Height: 4.2 mm

Low seated height allows for compact and slim device designs.

Width: 7.62 mm

Narrow width enables space-efficient placement on the PCB.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency allows for fast processing and data transfer speeds.

Length: 26.73 mm

Optimal length for fitting into various electronic devices and equipment.

Temperature Grade: COMMERCIAL

Commercial grade temperature range suitable for most general-purpose applications.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller for embedded system applications.

RAM Bytes: 128

Adequate RAM capacity for data storage and processing within the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and robust connections on the PCB.

Maximum Supply Current: 25 mA

Low maximum supply current consumption for efficient power usage.

Nominal Supply Voltage: 5 V

Standard 5V nominal supply voltage for compatibility with common power sources.

ROM Programmability: OTPROM

One-time programmable ROM for permanent program storage and security.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy soldering and connection to the PCB.

Speed: 20 rpm

High speed capabilities for rapid data processing and system responsiveness.

No. of I/O Lines: 18

Sufficient number of I/O lines for communication with external devices and peripherals.

Technical Specifications

Microcontrollers P87LPC762BN attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

CAN ALSO OPERATE AT 2.7V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

26.73 mm

No. of I/O Lines:

18

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

OTPROM

Maximum Seated Height:

4.2 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

P87LPC762BN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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