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P87C51X2FA

NXP Semiconductors

P87C51X2FA by NXP Semiconductors

The NXP Semiconductors P87C51X2FA is an 8051 microcontroller with 8-bit architecture, 16-bit address bus, and 8-bit external data bus. It operates at a max clock frequency of 33 MHz and has a ROM size of 4096 words. Ideal for industrial applications requiring a microcontroller with low power consumption and high-speed processing capabilities.

Median Price

$38.502

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 1,691 parts In-Stock

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$34.220

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$32.170

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$30.110

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$34.220

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DigiKey

USA . 1,691 parts In-Stock

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Verical

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Nova Conductors

Japan . 36 parts In-Stock

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$5.230

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Digiode

USA . 4,277 parts In-Stock

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$22.230

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DigiKey Marketplace

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Vyrian

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Anansix

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Pegasus Components GmbH

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Bristol Electronics

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Fibra_Brandt Electronic GMBH

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Distributors (Availability)

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Aranea Global

USA . 100 parts In-Stock

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$5.125

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$4.920

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Microchip USA

USA . 293 parts In-Stock

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$7.360

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$7.360

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$7.360

Ampacity Inc.

Singapore . 1,055 parts In-Stock

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Corphita

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Assy Fe

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Overview

Elevate your projects with the P87C51X2FA microcontroller from NXP Semiconductors. Designed with precision and reliability in mind, this powerful chip offers a wide range of applications in industries such as automotive, industrial automation, and consumer electronics. With its cutting-edge technology and advanced features, customers can enjoy seamless performance, optimized power consumption, and exceptional value for their projects. Upgrade your designs today with the P87C51X2FA and experience the difference of quality engineering at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and compact installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of voltage inputs, increasing compatibility with various systems.

Address Bus Width: 16

A wider address bus allows for efficient memory addressing and data transfer.

Bit Size: 8

An 8-bit architecture provides a good balance of performance and efficiency.

Power Supplies (V): 3/5

Supports multiple power supply options for flexibility in design and implementation.

No. of Terminals: 44

Sufficient number of terminals for connectivity and interfacing with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal performance and compact size.

Maximum Operating Temperature: 85 °C

Can operate in higher temperature environments, suitable for industrial applications.

CPU Family: 8051

Part of the popular and well-established 8051 CPU family, ensuring compatibility and support.

Minimum Operating Temperature: -40 °C

Can operate in very low temperature conditions, making it suitable for various environments.

ROM Words: 4096

Offers ample space for program storage and data handling.

Width: 16.5862 mm

Compact width size for space-constrained applications.

Maximum Clock Frequency: 33 MHz

High clock frequency for fast processing and response times.

RAM Bytes: 128

Adequate RAM capacity for storing working data and variables.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

ROM Programmability: OTPROM

One-time programmable ROM for secure and reliable program storage.

Maximum Supply Current: 0.05 mA

Low supply current for energy-efficient operation.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good resistance to moisture during storage and handling.

No. of I/O Lines: 32

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers P87C51X2FA attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 2.7 V MINIMUM SUPPLY @ 16MHZ

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

4096

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.05 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

P87C51X2FA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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