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P87C51RB2BA,512

NXP Semiconductors

P87C51RB2BA,512 by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;

Median Price

$3.190

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,591 parts In-Stock

1+ parts

$3.190

100+ parts

$3.130

1k+ parts

$3.060

10k+ parts

-

2,591

$3.190

$3.130

$3.060

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,389 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,389

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-

-

-

Digiode

USA . 3,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,128

-

-

-

-

Anansix

USA . 2,417 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,417

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 407 parts In-Stock

1+ parts

$5.232

100+ parts

-

1k+ parts

-

10k+ parts

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407

$5.232

-

-

-

One Stop Electronics

USA . 168 parts In-Stock

1+ parts

$17.000

100+ parts

-

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168

$17.000

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AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$17.690

100+ parts

-

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564

$17.690

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Corphita

USA . 3,325 parts In-Stock

1+ parts

-

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3,325

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UNI Independent Distributors

Spain . 2,140 parts In-Stock

1+ parts

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2,140

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Technical Specifications

Microcontrollers P87C51RB2BA,512 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

NO

Additional Features:

OPERATES AT 2.7V MINIMUM SUPPLY @ 16MHZ

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

33 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

33 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.63 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

P87C51RB2BA,512 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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