Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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P2020NSE2KFC by NXP Semiconductors is a microprocessor with 16-bit address bus width and 64-bit external data bus width. It features integrated cache, operates at a speed of 1000 rpm, and has 4 DMA channels. Ideal for applications requiring high processing power in compact devices.
Median Price
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This material is known for its durability and resistance to heat, making the microprocessor reliable for long-term use.
Having an integrated cache helps improve the performance of the microprocessor by reducing memory access times and increasing overall speed.
Being surface mountable makes the microprocessor easy to install and allows for compact and efficient circuit designs.
Operating at a low maximum supply voltage helps reduce power consumption and heat generation, making the microprocessor more energy-efficient.
With a wider address bus, the microprocessor can access and communicate with a larger range of memory addresses, enhancing its capability and performance.
The square shape of the package provides a uniform and efficient layout for the internal components of the microprocessor, aiding in heat dissipation and overall stability.
Operating at a nominal supply voltage of 1.05V strikes a good balance between performance and power efficiency for the microprocessor.
Having a high number of terminals allows for a greater number of connections and functionalities, making the microprocessor versatile and compatible with various systems.
The grid array package style provides a compact and organized layout for the terminals and internal components, optimizing space utilization and enhancing reliability.
Operating at a minimum supply voltage of 1V ensures the microprocessor's stability and functionality even under low-power conditions.
Having multiple external interrupts allows the microprocessor to efficiently handle and respond to external signals and events, improving its overall performance and responsiveness.
The tin silver finish on the terminals provides good conductivity and corrosion resistance, ensuring reliable connections and long-term durability.
Having the terminals positioned at the bottom makes it easier to mount and connect the microprocessor in a circuit, simplifying the installation process.
The relatively low maximum seated height allows for a compact and slim design of the microprocessor, making it suitable for space-constrained applications.
With a moderate width of 31mm, the microprocessor can easily fit into standard circuit designs and enclosures, enhancing its compatibility and ease of integration.
Having boundary scan support enables efficient testing and debugging of the microprocessor, facilitating easier production and maintenance processes.
With a wider external data bus width of 64, the microprocessor can handle larger chunks of data at a time, improving data transfer rates and overall performance.
The microprocessor can withstand peak reflow temperatures for up to 40 seconds, ensuring reliable soldering and assembly processes during manufacturing.
The microprocessor's ability to withstand peak reflow temperatures of 260°C indicates its reliability and durability under high-temperature conditions.
With a length of 31mm, the microprocessor has a compact form factor that can easily fit into various electronic devices and applications.
Being a RISC-based microprocessor, it is optimized for efficient and fast execution of instructions, making it suitable for high-performance computing tasks.
Utilizing CMOS technology allows the microprocessor to operate at low power levels while maintaining high performance, making it energy-efficient and versatile.
Having ball terminals simplifies the soldering and connection process, ensuring secure and reliable electrical connections for the microprocessor.
Operating at a nominal supply voltage of 1.05V ensures stability and consistent performance of the microprocessor under typical operating conditions.
Having multiple DMA channels allows for efficient data transfer and processing, improving the microprocessor's overall performance in handling data-intensive tasks.
With a terminal pitch of 1mm, the microprocessor can easily interface with standard connectors and circuit boards, enhancing its compatibility and ease of integration.
Operating in a fixed-point format simplifies arithmetic operations and enhances the microprocessor's efficiency in handling numerical calculations and data processing tasks.
Having a moisture sensitivity level of 3 indicates the microprocessor's resilience to moisture-related damage, ensuring reliability in various environmental conditions.
Operating at a speed of 1000 rpm indicates the microprocessor's capability to handle high-speed processing tasks and data transfers, making it suitable for demanding applications.
Microprocessors P2020NSE2KFC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of DMA Channels:
No. of External Interrupts:
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Speed:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
P2020NSE2KFC Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
2N7002
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
Nexperia
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
Hy Electronic
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
LM317T
Micro Commercial Components
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Moisture Sensitivity Level (MSL): 1; Maximum Output Current-1: 1.5 A; Operating Temperature (TJ-Min): 0 Cel;
International Semiconductor
1N4148WT
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
BAV99W-7-F
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
SN65HVD234DR
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
ATSAMA5D27C-LD2G-CUR22
Microchip Technology
ATSAMA5D27C-LD2G-CUR22 by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 24 MHz clock frequency, and 51 DMA channels. It is used in applications requiring high-speed processing, such as industrial automation and robotics due to its low power mode and floating-point format support.
14305R-500
Echelon
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
MCF5484CZP200
NXP Semiconductors
NXP Semiconductors MCF5484CZP200 is a 32-bit microprocessor with integrated cache, operating at max 66.67 MHz. Ideal for industrial applications, it features low power mode and boundary scan capability, with a package style of grid array and terminal pitch of 1 mm.
MCF54451CVM180
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
AM3351BZCE30
AM3351BZCE30 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications like IoT devices due to its low supply current of 400 mA.
MCIMX6U7CVM08AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;
NHPXA270C5C312
Intel
NHPXA270C5C312 by Intel is a 32-bit RISC microprocessor with integrated cache, operating at a max clock frequency of 3.6864 MHz. It features a 26-bit address bus width and external data bus width of 32 bits, suitable for low power mode applications in various devices due to its CMOS technology.
MCF5307CAI66B
MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Width: 28 mm;
AM6412BSCGGAALV
AM6412BSCGGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, making it suitable for high-speed computing applications. The package style is grid array, fine pitch, with a terminal pitch of 0.8 mm, ideal for compact designs requiring low power consumption.
MCF5475ZP266
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;
MIMXRT1064DVJ6A
The NXP Semiconductors MIMXRT1064DVJ6A microprocessor features a 32-bit architecture, 1.3V max supply voltage, and 24MHz clock frequency. Ideal for applications requiring low power consumption, it offers integrated cache memory and 32 DMA channels for efficient data processing in various electronic devices.
STM32MP135AAF3
STMicroelectronics
STM32MP135AAF3 by STMicroelectronics is a 32-bit microprocessor with 8-bit RAM width, 26-bit address bus, and 16-bit external data bus. It operates at a max clock frequency of 48 MHz and has low power mode. Ideal for applications requiring high-speed processing in compact devices.
MPC7410HX500LE
NXP Semiconductors' MPC7410HX500LE microprocessor features 32-bit address bus, 64-bit external data bus, and 133 MHz max clock frequency. Ideal for low power applications, this RISC processor with integrated cache is designed for high-speed computing in a compact square package.
STM32MP151AAB3T
STM32MP151AAB3T by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz clock frequency. It features 724992 RAM words, 26-bit address bus width, and low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.
MCF5270VM100J
MCF5270VM100J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and 24-bit address bus width. It operates at a max supply voltage of 1.6V and is suitable for applications requiring low power mode, such as embedded systems and industrial automation. With a package style of grid array and low profile, it offers high performance in a compact form factor.
MCF54455CVP200
MICROPROCESSOR; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
STM32MP131CAF3
STM32MP131CAF3 by STMicroelectronics is a 32-bit microprocessor with 48 MHz clock frequency, 172032 RAM words, and 56 DMA channels. It is used in applications requiring low power mode, such as IoT devices and embedded systems.
AM6442BSEFGAALV
Texas Instruments AM6442BSEFGAALV microprocessor features 64-bit architecture, 16-bit data RAM width, and 25 MHz clock frequency. Ideal for applications requiring high-speed processing in a compact form factor with low power consumption.
LE80537GF0484MSLGFV
Intel's LE80537GF0484MSLGFV microprocessor features 64-bit architecture, 479 terminals in a grid array package, and low power mode. Ideal for high-performance computing applications requiring efficient processing speed and integrated cache functionality.
P2020NSE2MHC
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Width: 31 mm;
P2020NXE2MHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
MICROPROCESSOR; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 689; Package Code: HBGA; Package Shape: SQUARE;
P2020NXE2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.05;
P2020NSE2MHB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 100 MHz;
P2020NSE2HHA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
P2020NSE2MHC,557
P2020NSE2HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;
P2020NSE2HHB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.05 V;
P2020NSE2KHB
P2020NSE2MHA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 64;
P2020NSE2KFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
P2020NSE2KHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER;
P2020NSE2HHC
P2020NSE2MFA
P2020NSE2MFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
P2020NSE2KHA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; No. of DMA Channels: 4;
P2020NSE2NFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B689;
Supply Digital Components
$106.00
$54.25
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$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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