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NX3DV42GM,115

NXP Semiconductors

NX3DV42GM,115 by NXP Semiconductors

NX3DV42GM,115 by NXP Semiconductors is a versatile DPDT switch designed for automotive applications. It operates b/w -40 °C to 125 °C with a max on-state resistance of 10Ω and supports power supplies of 3/4.3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,845 parts In-Stock

1+ parts

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3,845

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Digiode

USA . 1,907 parts In-Stock

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1,907

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Anansix

USA . 434 parts In-Stock

1+ parts

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434

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 368 parts In-Stock

1+ parts

$3.500

100+ parts

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368

$3.500

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UNI Independent Distributors

Spain . 4,793 parts In-Stock

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4,793

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Corphita

USA . 282 parts In-Stock

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282

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Overview

Unlock your design's potential with the NX3DV42GM,115 from NXP Semiconductors, a leader in innovation and quality. This high-performance multiplexer delivers reliable switching solutions across automotive and industrial applications, ensuring seamless functionality under extreme conditions. With excellent temperature resilience and compact design, it enhances system efficiency while simplifying integration. Elevate your projects with a trusted component that prioritizes performance and longevity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for a range of applications.

Surface Mount: YES

Enables compact design and high-density circuit layouts, promoting efficient use of space on printed circuit boards.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into diverse circuit designs, providing flexibility in layout.

Power Supplies (V): 3/4.3

Wide power supply range ensures compatibility with various systems, enhancing versatility in applications.

No. of Terminals: 10

The ten terminals provide multiple connection options, allowing for complex circuit configurations.

Package Style (Meter): CHIP CARRIER

Chip carrier style enhances thermal performance and reliability, suitable for high-performance applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes it suitable for demanding environments and automotive applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance in extreme cold conditions, ideal for outdoor use.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing of signals, improving layout and reducing interference.

Output (V): SEPARATE OUTPUT

Separate output capability provides isolation and flexibility for various circuit designs.

Other IC type: DPDT

Double-pole double-throw configuration offers versatility in switching applications, suitable for complex control circuits.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance supports robust soldering processes, essential for modern manufacturing.

Maximum On-state Resistance (Ron): 10 ohm

Low on-state resistance minimizes power loss and improves efficiency, making it suitable for power-sensitive applications.

Temperature Grade: AUTOMOTIVE

Automotive grade rating ensures the product meets stringent reliability and performance standards, suitable for vehicle applications.

Terminal Form: NO LEAD

No-lead design enhances space efficiency and simplifies PCB assembly, making it attractive for modern electronics.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for placement in densely packed PCBs, providing flexibility in design.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching prevents shorts and ensures safe operation in switching applications.

Technical Specifications

Multiplexers & Switches NX3DV42GM,115 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N10

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum On-state Resistance (Ron):

10 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC10,.06X.08,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/4.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

NX3DV42GM,115 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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