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NX3DV221GM

NXP Semiconductors

NX3DV221GM by NXP Semiconductors

NX3DV221GM by NXP Semiconductors is a differential multiplexer with a 2.5V nominal voltage and operates in extreme temperatures from -40 °C to 85 °C. It features low on-state resistance of 7Ω and fast switching times (50ns on, 23ns off). Ideal for industrial applications requiring compact, reliable signal routing.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Chip Stock

USA . 182,500 parts In-Stock

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Vyrian

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Digiode

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Anansix

USA . 2,117 parts In-Stock

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Component Sense

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One Stop Electronics

USA . 1,061 parts In-Stock

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Kepictronics

USA . 120,000 parts In-Stock

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Futuretech Components

Singapore . 120,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,428 parts In-Stock

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UNI Independent Distributors

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Perfect Parts

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Authorized Procurement Solutions

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S.R.D Solutions

India . 1,468 parts In-Stock

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Corphita

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Formix International (Excess)

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Overview

Unlock cutting-edge performance with NXP Semiconductors' NX3DV221GM, a premium multiplexer designed for reliability in challenging environments. Its compact, high-quality construction ensures seamless integration across various applications, from industrial controls to consumer electronics. Enjoy the peace of mind that comes with NXP's renowned expertise and commitment to excellence, enhancing your designs while maximizing efficiency and performance. Transform your connectivity solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on PCBs, enabling compact design solutions.

Package Shape: RECTANGULAR

The rectangular shape is optimal for placement in various circuit configurations, enhancing layout flexibility.

Nominal Supply Voltage (Vsup): 2.5 V

This nominal supply voltage is low, contributing to power efficiency in battery-operated devices.

No. of Terminals: 10

Having 10 terminals facilitates multiple connections, making it suitable for complex circuit designs.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile of the chip carrier ensures compatibility with modern ultra-compact electronic devices.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes the product reliable in harsh environments.

Minimum Operating Temperature: -40 °C

A broad operating temperature range from -40 °C to 85 °C ensures functionality in extreme weather conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish enhances solderability and ensures long-term reliability and durability of connections.

Terminal Position: QUAD

Quad terminal positioning enables flexible routing options and efficient layout on PCBs.

Maximum Seated Height: 0.5 mm

A low seated height ensures compatibility with low-profile designs and space-sensitive applications.

Width: 1.55 mm

The narrow width allows for high-density packing in circuit boards, ideal for miniaturized devices.

Other IC type: DIFFERENTIAL MULTIPLEXER

As a differential multiplexer, it provides signal integrity and higher performance for critical applications.

Minimum Supply Voltage (Vsup): 2.3 V

This low minimum supply voltage enhances system design flexibility, especially in low-voltage applications.

Maximum Time At Peak Reflow Temperature: 30 s

Short peak reflow times allow for faster manufacturing processes while avoiding damage to the IC.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature tolerance ensures compatibility with high-temperature soldering processes.

Maximum On-state Resistance (Ron): 7 ohm

Low on-state resistance minimizes power loss and heat generation, improving the efficiency of signal switching.

Maximum Switch-on Time: 50 ns

Quick switch-on time increases the speed of data transfer, making it suitable for high-speed applications.

Length: 2 mm

A compact length supports space-saving designs and efficient layout in contemporary electronics.

Maximum Switch-off Time: 23 ns

Fast switch-off time ensures rapid response in signal processing applications, enhancing overall performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability and performance in demanding environments.

No. of Channels: 6

Having 6 channels allows for multi-channel signal routing, increasing the versatility of device applications.

Terminal Form: NO LEAD

The no-lead design promotes improved thermal performance and is ideal for environmentally conscious manufacturing.

Terminal Pitch: 0.58 mm

A tight terminal pitch allows for denser array configurations on PCBs, maximizing space efficiency.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6 V provides compatibility for a wide range of applications including battery and low-voltage circuits.

Nominal Off-state Isolation: 38 dB

High off-state isolation reduces crosstalk and improves signal integrity in multiplexed systems.

Nominal On-state Resistance Match: 0.1 ohm

Tight on-state resistance matching enhances signal consistency and performance across channels.

Technical Specifications

Multiplexers & Switches NX3DV221GM attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N10

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

6

No. of Functions:

1

No. of Terminals:

10

Nominal Off-state Isolation:

38 dB

Nominal On-state Resistance Match:

.1 ohm

Maximum On-state Resistance (Ron):

7 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Maximum Switch-off Time:

23 ns

Maximum Switch-on Time:

50 ns

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.58 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.55 mm

Trade Compliance

NX3DV221GM Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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