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NX3DV2567HR

NXP Semiconductors

NX3DV2567HR by NXP Semiconductors

NX3DV2567HR by NXP Semiconductors is a 4-channel multiplexer with a max supply voltage of 4.3V and low on-state resistance of 0.8Ω, ideal for automotive applications. It operates b/w -40 °C to 125 °C, ensuring reliability in extreme conditions. Its compact design features a very thin profile and no lead terminals for efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 4,449 parts In-Stock

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Digiode

USA . 4,449 parts In-Stock

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Vyrian

USA . 4,148 parts In-Stock

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Anansix

USA . 1,265 parts In-Stock

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ComSIT Distribution GmbH

Germany . 54 parts In-Stock

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ComSIT USA

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One Stop Electronics

USA . 565 parts In-Stock

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Corphita

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Overview

Unlock superior signal routing with the NX3DV2567HR from NXP Semiconductors. Renowned for their commitment to quality and reliability, NXP delivers a versatile multiplexer designed for automotive applications and beyond. With its ultra-thin profile and robust performance in extreme temperatures, this component ensures seamless integration and longevity. Experience enhanced efficiency and precision in your designs—choose NX3DV2567HR for unparalleled value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance against environmental factors, ensuring longevity and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, making it easier to integrate into modern devices with limited space.

Package Shape: SQUARE

The square shape facilitates efficient PCB layout and provides flexibility in placement on the board.

Nominal Supply Voltage (Vsup): 1.5 V

A low nominal supply voltage improves energy efficiency, making this product suitable for battery-operated devices.

No. of Terminals: 16

The 16 terminals enable multiple connections, ensuring versatility for various circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package design aids in thermal management while maintaining a slim profile, essential for compact electronic designs.

Maximum Operating Temperature: 125 °C

High-temperature tolerance makes this product suitable for use in demanding automotive and industrial environments.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures enhances reliability in harsh climates, ideal for automotive applications.

Terminal Position: QUAD

Quad terminal positioning optimizes space usage and simplifies routing on printed circuit boards.

Maximum Seated Height: 0.5 mm

A low seated height allows for better clearance in densely packed assemblies, contributing to an overall compact design.

Width: 3 mm

With a width of just 3 mm, the component is easily installable in tight layouts, making it ideal for miniature devices.

Other IC Type: 4PDT

The 4PDT configuration provides multiple switching capabilities, offering flexibility in circuit design.

Minimum Supply Voltage (Vsup): 1.4 V

The capability to operate at a minimum voltage enhances energy savings and expands application possibilities.

Maximum On-state Resistance (Ron): 0.8 ohm

Low on-state resistance minimizes power losses, improving efficiency in switch applications.

Maximum Switch-on Time: 120 ns

Fast switch-on times ensure rapid response in applications, enhancing signal integrity and performance.

Length: 3 mm

A compact length promotes space efficiency, enabling integration into small electronic devices.

Maximum Switch-off Time: 90 ns

Swift switch-off times contribute to preventing signal distortion, beneficial for high-speed applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, this product is robust for use in vehicles, ensuring reliability in critical applications.

No. of Channels: 4

Having four channels allows simultaneous switching operations, increasing functionality and reducing board space.

Terminal Form: NO LEAD

Lead-free terminals promote environmentally friendly manufacturing practices, complying with global regulations.

Terminal Pitch: 0.5 mm

The fine pitch supports high-density layouts, facilitating modern electronic designs while maintaining performance.

Maximum Supply Voltage (Vsup): 4.3 V

This flexibility in maximum voltage allows use in a wider range of applications without risking damage to the component.

Nominal Off-state Isolation: 60 dB

High off-state isolation minimizes noise and interference, crucial for maintaining the integrity of signals in complex circuits.

Technical Specifications

Multiplexers & Switches NX3DV2567HR attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

60 dB

Maximum On-state Resistance (Ron):

.8 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Maximum Switch-off Time:

90 ns

Maximum Switch-on Time:

120 ns

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

NX3DV2567HR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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