Loading...

NTS0102GU,115

NXP Semiconductors

NTS0102GU,115 by NXP Semiconductors

NTS0102GU,115 by NXP Semiconductors is a versatile line transceiver with a max supply voltage of 5.5V and operates in extreme temps from -40 °C to 125 °C. It features an 8.8 ns max transmit/receive delay, ideal for automotive applications. Its compact design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,911 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,911

-

-

-

-

Anansix

USA . 2,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,271

-

-

-

-

Digiode

USA . 424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

424

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 603 parts In-Stock

1+ parts

$9.500

100+ parts

-

1k+ parts

-

10k+ parts

-

603

$9.500

-

-

-

Ampacity Inc.

Singapore . 219 parts In-Stock

1+ parts

$21.500

100+ parts

-

1k+ parts

-

10k+ parts

-

219

$21.500

-

-

-

UNI Independent Distributors

Spain . 3,401 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,401

-

-

-

-

Corphita

USA . 3,394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,394

-

-

-

-

Overview

Unlock superior performance with the NTS0102GU,115 from NXP Semiconductors—a trusted leader in innovative technology. This cutting-edge line driver and receiver excels in automotive applications, delivering unmatched reliability and efficiency. With a compact design and robust temperature range, it ensures seamless operation in demanding environments. Elevate your projects with this high-quality solution that promises durability, enhanced signal integrity, and exceptional value for your investment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliable performance and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V provides flexibility in a variety of applications without exceeding power limits.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for space-saving and effective heat dissipation.

Maximum Transmit Delay: 8.8 ns

A low transmit delay ensures high-speed data communication, ideal for demanding applications.

Maximum Supply Voltage-1: 5.5 V

Supports higher supply voltages making it suitable for various circuit configurations.

Power Supplies (V): 1.8/3.3, 2.5/5

Compatible with a wide range of supply voltages, enhancing versatility in design.

No. of Terminals: 10

Ten terminals provide ample connectivity options for various signals and power supplies.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile package minimizes board space usage, making it an excellent choice for compact applications.

Minimum Supply Voltage-1: 2.3 V

The ability to operate at lower voltage levels enhances compatibility with more circuits.

Minimum Supply Voltage: 1.65 V

This low minimum voltage supports energy-efficient applications.

Maximum Operating Temperature: 125 °C

A high operational temperature allows use in harsh environments, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Operating at low temperatures ensures reliable performance in extreme conditions.

Terminal Finish: MATTE TIN

The matte tin finish improves solderability and overall component reliability.

Terminal Position: QUAD

Quad terminal positioning offers a balanced connection for better signal integrity.

Maximum Seated Height: 0.5 mm

A low seated height is essential for dense circuit designs and compatibility with low-profile applications.

Width: 1.4 mm

This compact width enhances space efficiency on PCB layouts.

Receiver No. of Bits: 2

A 2-bit receiver allows for simple data transmission needs while maintaining performance.

Peak Reflow Temperature °C: 260

A high reflow temperature tolerance enables compatibility with modern soldering processes.

Length: 1.8 mm

A small length supports space-constrained designs without sacrificing functionality.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring high reliability and performance under variable conditions.

Maximum Receive Delay: 8.8 ns

A low receive delay contributes to the overall high-speed performance critical for demanding applications.

Terminal Form: NO LEAD

No lead design optimizes footprint and is advantageous in reducing lead-related issues during manufacturing.

Input Characteristics: STANDARD

Standard input characteristics facilitate easy integration into existing systems.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V supports power-efficient designs while maintaining adequate performance.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch is optimal for high-density applications, reducing PCB space requirements.

Nominal Supply Voltage-1: 2.5 V

Provides additional flexibility for various power supply configurations, enhancing adaptability.

Driver No. of Bits: 2

A 2-bit driver is efficient for straightforward data transmission, matching well with the receiver specifications.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specifically designed for reliable line communication, making it a robust solution.

Technical Specifications

Line Drivers & Receivers NTS0102GU,115 attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PQCC-N10

JESD-609 Code:

e3

Length:

1.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC10,.06X.07,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3,2.5/5

Qualification:

Not Qualified

Maximum Receive Delay:

8.8 ns

Receiver No. of Bits:

2

Maximum Seated Height:

.5 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

2.3 V

Nominal Supply Voltage-1:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

8.8 ns

Width:

1.4 mm

Trade Compliance

NTS0102GU,115 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17