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NTS0102DP

NXP Semiconductors

NTS0102DP by NXP Semiconductors

NTS0102DP by NXP Semiconductors is a line transceiver designed for automotive applications, featuring a max supply voltage of 5.5 V and operating temp range from -40 °C to 125 °C. It offers fast transmit/receive delays of just 8.8 ns. This compact device supports surface mount with an 8-terminal configuration.

Median Price

$3.600

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,847 parts In-Stock

1+ parts

$3.600

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1,847

$3.600

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Chip Stock

USA . 33,500 parts In-Stock

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33,500

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Anansix

USA . 2,739 parts In-Stock

1+ parts

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2,739

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Digiode

USA . 1,318 parts In-Stock

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1,318

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Distributors (Availability)

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One Stop Electronics

USA . 226 parts In-Stock

1+ parts

$18.500

100+ parts

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226

$18.500

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Kepictronics

USA . 8,318 parts In-Stock

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8,318

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,955 parts In-Stock

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4,955

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Infinite Electronics LLP (Excess)

. 3,004 parts In-Stock

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3,004

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A-Z Elektronik GmbH

Germany . 2,940 parts In-Stock

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2,940

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UNI Independent Distributors

Spain . 1,795 parts In-Stock

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1,795

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Futuretech Components

Singapore . 504 parts In-Stock

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504

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Perfect Parts

USA . 140 parts In-Stock

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140

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Overview

Elevate your projects with the NTS0102DP from NXP Semiconductors—your reliable solution for efficient line driving and receiving. Crafted from high-quality materials, this compact surface mount device ensures optimal performance in automotive applications, delivering superior speed and thermal reliability. With NXP's reputation for excellence, experience enhanced connectivity, lower power consumption, and seamless integration that empowers innovation while keeping your designs robust and future-ready.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making this product reliable in various conditions.

Surface Mount: YES

Surface mount technology allows for a compact design and easy integration on circuit boards, enhancing production efficiency.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a wide range of digital systems, providing flexibility in design.

Package Shape: SQUARE

The square package shape offers efficient space utilization on PCB layouts, making it ideal for space-constrained applications.

Maximum Transmit Delay: 8.8 ns

Low transmit delay allows for high-speed communication, making this device suitable for time-sensitive applications.

Maximum Supply Voltage-1: 5.5 V

Supports a wider operational voltage range, ensuring robustness in diverse voltage environments.

No. of Terminals: 8

With 8 terminals, this device offers flexibility and versatility in connection and configuration possibilities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small and thin profile allows for efficient use of space on the PCB, especially in compact designs.

Minimum Supply Voltage-1: 2.3 V

The wide supply voltage range ensures compatibility with low-voltage systems, catering to modern energy-efficient designs.

Minimum Supply Voltage: 1.65 V

A low minimum supply voltage ensures that this device can operate in battery-powered applications effectively.

Maximum Operating Temperature: 125 °C

This high operating temperature rating allows the product to be used in demanding automotive and industrial environments.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature rating makes this product suitable for use in extreme conditions commonly found in automotive applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing the longevity of the product.

Terminal Position: DUAL

Dual terminal positioning allows for flexible placement on PCBs, aiding in design optimization.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a slimmer design, making it suitable for modern compact electronic devices.

Width: 3 mm

Compact width ensures minimal PCB footprint, which is beneficial for tight designs.

Receiver No. of Bits: 2

The 2-bit receiver capability allows for simple data transfer configurations in communication applications.

Maximum Time At Peak Reflow Temperature (s): 30

A 30-second limit at peak reflow allows for effective soldering without damaging the components, ensuring reliability after assembly.

Peak Reflow Temperature °C: 260

A high peak reflow temperature compatibility ensures the device can withstand the assembly process in high-performance electronics.

Length: 3 mm

The compact length aids in designs where space is a premium, fitting seamlessly into smaller devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets stringent standards for reliability and performance in critical environments.

Maximum Receive Delay: 8.8 ns

Similar to transmit delay, a low receive delay ensures high-speed data integrity and responsiveness.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve board layout flexibility, enhancing assembly processes.

Input Characteristics: STANDARD

Standard input characteristics simplify integration with other components, ensuring compatibility across various designs.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage is ideal for modern digital circuits, ensuring efficient power consumption.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for high-density connections, making it suitable for advanced electronic applications.

Nominal Supply Voltage-1: 2.5 V

Supports various supply voltage requirements, enhancing versatility in design applications.

Driver No. of Bits: 2

With a 2-bit driver, this device facilitates simple and efficient data transmission, making it ideal for straightforward applications.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC excels in bidirectional data transmission, essential for effective communication protocols.

Technical Specifications

Line Drivers & Receivers NTS0102DP attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

8.8 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

2.3 V

Nominal Supply Voltage-1:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

8.8 ns

Width:

3 mm

Trade Compliance

NTS0102DP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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