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NTS0102GF

NXP Semiconductors

NTS0102GF by NXP Semiconductors

NTS0102GF by NXP Semiconductors is a compact line transceiver with a max supply voltage of 5.5V and operates in extreme temperatures from -40 °C to 125 °C. It features an 8.8 ns max transmit/receive delay, ideal for automotive applications. Its small outline design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 6,500 parts In-Stock

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6,500

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Vyrian

USA . 4,701 parts In-Stock

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4,701

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Anansix

USA . 2,105 parts In-Stock

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2,105

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Digiode

USA . 2,057 parts In-Stock

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2,057

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Distributors (Availability)

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One Stop Electronics

USA . 170 parts In-Stock

1+ parts

$49.500

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170

$49.500

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A-Z Elektronik GmbH

Germany . 6,008 parts In-Stock

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6,008

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UNI Independent Distributors

Spain . 4,363 parts In-Stock

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4,363

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,555 parts In-Stock

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Kepictronics

USA . 362 parts In-Stock

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362

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Overview

Elevate your designs with the NTS0102GF by NXP Semiconductors, a top-tier line driver and receiver that ensures unmatched reliability and precision. Crafted from high-quality plastic and epoxy, this compact component boasts an impressive temperature range, making it ideal for automotive applications. Experience seamless integration, reduced delays, and enhanced performance, empowering you to create innovative solutions that drive efficiency and excellence in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental stressors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient utilization of PCB space, enabling integration into high-density circuits.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage supports a wide range of applications while ensuring safety and reliability in operation.

Package Shape: RECTANGULAR

Rectangular packaging is optimized for layout consistency in PCB designs, facilitating easier stacking and placement.

Maximum Transmit Delay: 8.8 ns

A low transmit delay enhances the speed of data transfer, making it ideal for high-speed communication systems.

Maximum Supply Voltage-1: 5.5 V

Supporting a high supply voltage provides versatility for various applications, catering to both low and high voltage requirements.

No. of Terminals: 8

Eight terminals make the device capable of handling multiple connections, enhancing its functionality in complex circuits.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile enable space-saving designs, perfect for modern compact electronic devices.

Minimum Supply Voltage-1: 2.3 V

A low minimum supply voltage allows for low-power applications, making it suitable for battery-operated devices.

Minimum Supply Voltage: 1.65 V

A very low minimum supply voltage enhances operational flexibility in low-voltage systems, maximising power efficiency.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance allows for use in extreme environments, ensuring reliability in automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range supports operation in harsh conditions, making it suitable for outdoor and automotive functions.

Terminal Finish: Tin (Sn)

Tin plating provides good solderability and corrosion resistance, improving the longevity and reliability of the connections.

Terminal Position: DUAL

Dual terminal positioning optimizes connection flexibility, simplifying integration into various circuit designs.

Maximum Seated Height: 0.5 mm

A low seated height minimizes space requirements on the PCB, contributing to a slim and compact design.

Width: 1 mm

A narrow width facilitates high-density layouts, perfect for space-constrained applications in modern electronics.

Receiver No. of Bits: 2

Two-bit reception capability allows for simple yet effective data transmission, ideal for basic communication needs.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates good thermal resistance, ensuring reliable soldering during the manufacturing process.

Peak Reflow Temperature (°C): 260

A high peak reflow temperature accommodates modern soldering techniques, ensuring compatibility with advanced assembly processes.

Length: 1.35 mm

The compact length provides versatility in design, allowing for efficient layout in tight spaces.

Temperature Grade: AUTOMOTIVE

Being rated for automotive applications guarantees high reliability and performance under severe temperature and stress conditions.

Maximum Receive Delay: 8.8 ns

A minimal receive delay enhances overall data communication speed, critical for real-time processing applications.

Terminal Form: NO LEAD

No lead design reduces size and weight, and is more environmentally friendly as it eliminates lead components.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with a wide range of devices, facilitating easier integration.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V allows for efficient power consumption, making it suitable for low-power applications.

Terminal Pitch: 0.35 mm

A small terminal pitch enables compact layouts on PCBs, optimizing space utilization in intricate circuit designs.

Nominal Supply Voltage-1: 2.5 V

Supports multiple supply voltage levels, providing versatility for various electronic applications.

Driver No. of Bits: 2

Two-bit driver capability allows for effective handling of digital signals, making it a dependable choice for data transmission.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is designed for effective data transmission over long distances, enhancing communication reliability.

Technical Specifications

Line Drivers & Receivers NTS0102GF attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

1.35 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

8.8 ns

Receiver No. of Bits:

2

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

2.3 V

Nominal Supply Voltage-1:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

8.8 ns

Width:

1 mm

Trade Compliance

NTS0102GF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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