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N74F299N,602

NXP Semiconductors

N74F299N,602 by NXP Semiconductors

PARALLEL IN PARALLEL OUT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$1.314

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,880 parts In-Stock

1+ parts

-

100+ parts

$1.290

1k+ parts

$1.070

10k+ parts

$0.955

2,880

-

$1.290

$1.070

$0.955

Verical

USA . 2,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.337

10k+ parts

$1.193

2,160

-

-

$1.337

$1.193

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,917 parts In-Stock

1+ parts

$0.515

100+ parts

-

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-

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4,917

$0.515

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-

-

Vyrian

USA . 7,715 parts In-Stock

1+ parts

-

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7,715

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-

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Anansix

USA . 1,117 parts In-Stock

1+ parts

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1,117

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,177 parts In-Stock

1+ parts

$0.488

100+ parts

-

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-

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-

2,177

$0.488

-

-

-

Microchip USA

USA . 310 parts In-Stock

1+ parts

$4.696

100+ parts

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310

$4.696

-

-

-

AZTECH Wire

Italy . 576 parts In-Stock

1+ parts

$8.960

100+ parts

-

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576

$8.960

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A-Z Elektronik GmbH

Germany . 5,921 parts In-Stock

1+ parts

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5,921

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UNI Independent Distributors

Spain . 3,878 parts In-Stock

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3,878

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 720 parts In-Stock

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720

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Technical Specifications

Digital Shift Registers N74F299N,602 attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Additional Features:

HOLD MODE; COMMON I/O PINS; TOTEMPOLE SERIAL SHIFT RIGHT & SHIFT LEFT OUTPUTS; GATED OUTPUT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

F/FAST

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

26.73 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

70000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

90 mA

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

85 MHz

Trade Compliance

N74F299N,602 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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