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74HC165BQ-Q100

NXP Semiconductors

74HC165BQ-Q100 by NXP Semiconductors

NXP Semiconductors' 74HC165BQ-Q100 is an 8-bit digital shift register with a propagation delay of 250 ns. Operating at a supply voltage range of 2-6V, it is AEC-Q100 compliant for automotive applications. This CMOS technology chip has a max operating temperature of 125°C and is suitable for use in automotive electronics due to its compact size and low power consumption.

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Vyrian

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Nova Conductors

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Semicontronic

India . 852 parts In-Stock

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AZTECH Wire

Italy . 8,587 parts In-Stock

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Aztec Data Supply Inc.

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Ampacity Inc.

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One Stop Electronics

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Upgrade your digital shift register game with the 74HC165BQ-Q100 by NXP Semiconductors. A leading manufacturer in the industry, NXP ensures top-notch quality and reliability in all their products. Ideal for automotive applications, this chip carrier with a heat sink boasts a very thin profile, making it perfect for space-constrained projects. With a fast propagation delay of 250 ns and a maximum operating temperature of 125°C, this chip delivers high performance while offering ease of use. Say goodbye to slow response times and hello to efficient data transfer with the 74HC165BQ-Q100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product reliable and affordable.

Surface Mount: YES

Makes it easier to integrate into circuit boards, saving space and improving overall design aesthetics.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, making it suitable for automotive applications where durability is crucial.

Propagation Delay: 250 ns

Fast propagation delay enables quick data transmission, improving overall performance of the product.

Temperature Grade: AUTOMOTIVE

Designed to operate in a wide temperature range, making it suitable for automotive applications where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Minimum fmax: 24 MHz

High maximum clock frequency allows for fast data processing and high-speed operation, making it suitable for applications requiring quick data transfer.

Technical Specifications

Digital Shift Registers 74HC165BQ-Q100 attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PQCC-N16

Length:

3.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Propagation Delay (tpd):

250 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

2.5 mm

Minimum fmax:

24 MHz

Trade Compliance

74HC165BQ-Q100 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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