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N74F164D

NXP Semiconductors

N74F164D by NXP Semiconductors

N74F164D by NXP Semiconductors is an 8-bit digital shift register with a 5V nominal voltage and a propagation delay of just 11 ns. It features surface mount technology in a compact SO package, ideal for high-speed data processing applications. Operating within -0 °C to 70 °C, it supports TTL logic levels and offers reliable performance in commercial environments.

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Digiode

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Vyrian

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Manoshevitz Elec. Sales

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Bristol Electronics

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J2 Sourcing AB

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Anansix

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ComSIT Distribution GmbH

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PC Components Company LLC

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One Stop Electronics

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Kepictronics

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Overview

Unlock the power of efficiency and reliability with the N74F164D from NXP Semiconductors. This robust 8-bit digital shift register delivers exceptional performance, designed for a variety of applications including data processing and control systems. With NXP's renowned quality assurance, you can trust in its durability and precision. Elevate your projects with seamless integration, reduced delays, and enhanced functionality—experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and reliability in various environments.

Surface Mount: YES

Facilitates easier assembly and efficient use of PCB space.

Package Shape: RECTANGULAR

Optimizes layout on PCB for effective routing and component placement.

No. of Bits: 8

Provides sufficient data handling capabilities for a range of applications.

Nominal Supply Voltage / Vsup: 5 V

Standard voltage level ensures compatibility with most digital systems.

Load Capacitance (CL): 50 pF

Low load capacitance enhances speed and reduces power consumption.

No. of Terminals: 14

Offers flexibility in circuit design while maintaining compactness.

Package Style (Meter): SMALL OUTLINE

Compact package style allows for high-density mounting on PCBs.

Propagation Delay (tpd): 11 ns

Fast delay time improves overall circuit performance and responsiveness.

Maximum Operating Temperature: 70 °C

Sufficient thermal capability ensures stable operation in moderately high temperatures.

Trigger Type: POSITIVE EDGE

Enables reliable operation with synchronous systems while reducing noise susceptibility.

Minimum Operating Temperature: 0 °C

Wide operational range allows for diverse application in various environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent electrical conductivity and protection against corrosion.

Terminal Position: DUAL

Facilitates efficient routing and connection options on the PCB.

Maximum Seated Height: 1.75 mm

Low profile design allows for compact system design and thermally efficient layouts.

Width: 3.9 mm

Compact width saves space on the PCB, enabling more components.

Output Polarity: TRUE

Simplifies design for systems requiring a straightforward logic output.

Minimum Supply Voltage (Vsup): 4.5 V

Allows for flexibility in operation and compatibility with a variety of power sources.

Maximum Time At Peak Reflow Temperature: 30 s

Ensures reliable solder connections during assembly, reducing failures.

Peak Reflow Temperature: 260 °C

Compatible with modern soldering techniques ensuring robust assembly.

Length: 8.65 mm

Compact length is ideal for space-constrained applications.

Temperature Grade: COMMERCIAL

Suitable for general-purpose applications in a controlled environment.

Technology: TTL

Provides high-speed operation and compatibility with TTL logic families.

Terminal Form: GULL WING

Ensures reliable surface mounting and effective thermal dissipation.

Terminal Pitch: 1.27 mm

Standard terminal pitch offers compatibility with a wide range of PCB designs.

Count Direction: RIGHT

Facilitates straightforward integration into right direction counting applications.

Minimum fmax: 80 MHz

High frequency capability allows for fast data processing in demanding applications.

Maximum Supply Voltage (Vsup): 5.5 V

Offers flexibility in supply voltage tolerances for enhanced application versatility.

Maximum Power Supply Current (ICC): 55 mA

Moderate current consumption supports power efficiency in designs.

Technical Specifications

Digital Shift Registers N74F164D attributes and parameters. Explore more Digital Shift Registers devices from NXP Semiconductors

Specs

Count Direction:

RIGHT

Family:

F/FAST

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

80 MHz

Trade Compliance

N74F164D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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