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MVF61NS152CMK50

NXP Semiconductors

MVF61NS152CMK50 by NXP Semiconductors

NXP Semiconductors' MVF61NS152CMK50 is a 32-bit microcontroller with a max clock frequency of 24 MHz. Featuring 364 terminals in a grid array package style, it operates at supply voltages ranging from 3V to 3.6V. Ideal for applications requiring high-speed processing and multiple ADC/DMA channels.

Median Price

$35.067

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 1,440 parts In-Stock

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-

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1,440

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Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$35.067

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15

$35.067

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Digiode

USA . 2,858 parts In-Stock

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2,858

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Flip Electronics

USA . 2,250 parts In-Stock

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2,250

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Vyrian

USA . 1,945 parts In-Stock

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1,945

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Anansix

USA . 909 parts In-Stock

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909

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Distributors (Availability)

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Ampacity Inc.

Singapore . 924 parts In-Stock

1+ parts

$12.000

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924

$12.000

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AZTECH Wire

Italy . 395 parts In-Stock

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$19.060

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395

$19.060

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One Stop Electronics

USA . 1,308 parts In-Stock

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$22.000

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$22.000

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Semicontronic

India . 1,369 parts In-Stock

1+ parts

$26.000

100+ parts

$25.350

1k+ parts

$25.220

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-

1,369

$26.000

$25.350

$25.220

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Continental Prestige Electronics

USA . 3,294 parts In-Stock

1+ parts

$35.067

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$34.365

3,294

$35.067

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$34.365

Corohmni

South Africa . 530 parts In-Stock

1+ parts

$63.926

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530

$63.926

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Microchip USA

USA . 3,128 parts In-Stock

1+ parts

$73.462

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3,128

$73.462

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Aztec Data Supply Inc.

USA . 11,915 parts In-Stock

1+ parts

$79.900

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$79.900

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UNI Independent Distributors

Spain . 6,001 parts In-Stock

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Corphita

USA . 4,544 parts In-Stock

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Robosynatics

Brazil . 4,229 parts In-Stock

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4,229

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Lucentia Tech

USA . 4,229 parts In-Stock

1+ parts

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100+ parts

$78.589

1k+ parts

$76.985

10k+ parts

$76.985

4,229

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$78.589

$76.985

$76.985

Argo Parts USA

USA . 3,071 parts In-Stock

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3,071

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$34.365

1k+ parts

$33.313

10k+ parts

$32.612

1,000

-

$34.365

$33.313

$32.612

Futuretech Components

Singapore . 250 parts In-Stock

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250

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Overview

Unleash the power of innovation with the MVF61NS152CMK50 by NXP Semiconductors. As a leading manufacturer of cutting-edge microcontrollers, NXP delivers top-quality products that push boundaries and drive progress in various applications. Whether you are developing smart devices, automotive systems, or industrial equipment, this versatile microcontroller offers unmatched value, performance, and reliability. Stay ahead of the competition and revolutionize your designs with NXP's MVF61NS152CMK50.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power input options.

Package Shape: SQUARE

Allows for compact and space-saving designs.

Bit Size: 32

Offers high computing power for various applications.

No. of Terminals: 364

Provides ample connectivity options for peripherals.

Package Style (Meter): GRID ARRAY

Ensures reliable solder joints during assembly.

Minimum Supply Voltage: 3 V

Allows for operation at lower power levels.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and durability.

ADC Channels: YES

Enables analog data conversion for sensor interfacing.

DMA Channels: YES

Facilitates efficient and high-speed data transfer.

Terminal Position: BOTTOM

Offers easy access and connections for soldering.

Width: 17 mm

Contributes to a compact and space-efficient design.

Maximum Clock Frequency: 24 MHz

Provides fast processing speeds for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures proper solder reflow during assembly.

Peak Reflow Temperature °C: 260

Sufficiently high temperature for reliable soldering.

Length: 17 mm

Complements the square package shape for a uniform design.

Peripheral IC Type: MICROCONTROLLER, RISC

Offers efficiency and high performance for embedded systems.

Terminal Form: BALL

Provides reliable and secure solder connections.

Nominal Supply Voltage: 3.3 V

Standard power input for compatibility with various systems.

Terminal Pitch: 0.8 mm

Allows for fine pitch connections for compact PCB designs.

Moisture Sensitivity Level (MSL): 3

Ensures proper handling and storage to maintain component integrity.

Speed: 500 rpm

Suitable for high-speed data processing and communication.

Technical Specifications

Microcontrollers MVF61NS152CMK50 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

364

PWM Channels:

NO

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Speed:

500 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

MVF61NS152CMK50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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