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MRF373R1

NXP Semiconductors

MRF373R1 by NXP Semiconductors

NXP Semiconductors' MRF373R1 is a single N-channel RF Power FET for amplifier applications. With a max drain current of 7A, it operates in the ultra-high frequency band and has a max power dissipation of 173W. The transistor's ceramic-metal-sealed package body material ensures reliable performance at up to 150°C operating temperature.

Median Price

$43.762

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 60 parts In-Stock

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$38.900

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$34.810

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$32.760

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$32.760

DigiKey

USA . 60 parts In-Stock

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Verical

USA . 60 parts In-Stock

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$48.625

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$43.513

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$40.950

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$48.625

$43.513

$40.950

Distributors (In-Stock)

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Digiode

USA . 3,054 parts In-Stock

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$41.173

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Vyrian

USA . 7,264 parts In-Stock

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Anansix

USA . 1,641 parts In-Stock

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DigiKey Marketplace

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One Stop Electronics

USA . 60 parts In-Stock

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$36.840

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$36.840

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Corphita

USA . 414 parts In-Stock

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$39.006

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414

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Continental Prestige Electronics

USA . 60 parts In-Stock

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$52.000

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Microchip USA

USA . 8,864 parts In-Stock

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$95.680

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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UNI Independent Distributors

Spain . 1,482 parts In-Stock

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Overview

Unleash the power of RF technology with the NXP Semiconductors MRF373R1. This high-quality RF Power Field Effect Transistor (FET) offers unmatched performance and reliability for a wide range of amplifier applications. With a maximum power dissipation of 173W and operating at ultra-high frequencies, this transistor delivers exceptional value to customers looking for top-notch quality and efficiency. Trust NXP Semiconductors to provide cutting-edge solutions that push the boundaries of technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired body material provides excellent durability and reliability for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel type FETs typically have better performance characteristics compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE

Single configuration FETs are simple to use and ideal for basic amplifier applications.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in signal boosting.

Surface Mount: YES

Surface mount capability allows for easy and space-efficient integration onto circuit boards.

Minimum DS Breakdown Voltage: 65 V

The minimum breakdown voltage of 65V ensures reliability and protection against voltage spikes.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient placement and alignment on circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides faster response times and improved efficiency in amplification.

Highest Frequency Band: ULTRA HIGH FREQUENCY BAND

Designed for ultra-high frequency bands, offering superior performance in high-frequency applications.

Maximum Drain Current (Abs) (ID): 7 A

High maximum drain current rating of 7A allows for handling of high power levels without overheating.

No. of Terminals: 2

Simple 2-terminal design for easy integration and connectivity in circuits.

Maximum Power Dissipation (Abs): 173 W

High maximum power dissipation rating of 173W ensures the FET can handle high power levels without damage.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mounting and heat dissipation for improved performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FET technology offers low gate capacitance and high input impedance for efficient amplification.

Maximum Operating Temperature: 150 °C

Maximum operating temperature of 150°C ensures reliable performance in high-temperature environments.

Transistor Element Material: SILICON

Silicon material provides good electrical properties and reliability for the transistor element.

Terminal Position: DUAL

Dual terminal position allows for flexible installation and connection options.

Case Connection: SOURCE

Source case connection allows for convenient grounding and efficient signal flow.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF373R1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

ULTRA HIGH FREQUENCY BAND

JESD-30 Code:

R-CDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF373R1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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