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MK51DX256CLK7

NXP Semiconductors

MK51DX256CLK7 by NXP Semiconductors

NXP's MK51DX256CLK7 microcontroller features a 32-bit CPU, 262144 ROM words, and 65536 RAM bytes. With a max clock frequency of 50 MHz, it is ideal for industrial applications requiring high-speed processing and multiple ADC/DAC channels. The compact square package with 80 terminals makes it suitable for space-constrained designs.

Median Price

$8.110

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

MK51DX256CLK7 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 96 parts In-Stock

1+ parts

$6.500

100+ parts

$6.370

1k+ parts

$6.240

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96

$6.500

$6.370

$6.240

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Verical

USA . 9,600 parts In-Stock

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$9.721

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$9.721

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Flip Electronics (Authorized)

USA . 1,097 parts In-Stock

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1,097

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Digiode

USA . 3,244 parts In-Stock

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$10.478

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3,244

$10.478

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Vyrian

USA . 3,898 parts In-Stock

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$11.030

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3,898

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Anansix

USA . 2,262 parts In-Stock

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2,262

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Flip Electronics

USA . 1,097 parts In-Stock

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1,097

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Chip Stock

USA . 218 parts In-Stock

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218

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Distributors (Availability)

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Ampacity Inc.

Singapore . 583 parts In-Stock

1+ parts

$9.380

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583

$9.380

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Corphita

USA . 800 parts In-Stock

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$9.927

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800

$9.927

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Component Stockers USA

USA . 120 parts In-Stock

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$10.750

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$10.100

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120

$10.750

$10.100

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Microchip USA

USA . 1,410 parts In-Stock

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$48.300

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1,410

$48.300

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Corohmni

South Africa . 24 parts In-Stock

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$75.107

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24

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QUARKTWIN TECHNOLOGY LTD

USA . 13,620 parts In-Stock

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UNI Independent Distributors

Spain . 4,410 parts In-Stock

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iodParts Technologies Inc.

India . 3,900 parts In-Stock

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3,900

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Perfect Parts

USA . 108 parts In-Stock

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108

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Netroflash

USA . 50 parts In-Stock

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Overview

Unlock the full potential of your next project with the MK51DX256CLK7 microcontroller from NXP Semiconductors. Designed with precision and reliability in mind, this innovative device offers unparalleled performance in a wide range of applications. With advanced features like DAC and ADC channels, PWM capabilities, and a powerful Cortex-M4 CPU, this microcontroller provides the perfect balance of power and efficiency. Whether you're working on industrial automation, consumer electronics, or IoT devices, the MK51DX256CLK7 delivers the value, benefits, and advantages you need to take your designs to the next level. Elevate your projects with NXP Semiconductors today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and stability, making the product suitable for various environments and conditions.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage provides flexibility in power requirements and compatibility with a wide range of applications.

Package Shape: SQUARE

Square shape packaging facilitates efficient placement on circuit boards and ensures uniformity in design.

Bit Size: 32

32-bit architecture allows for enhanced performance and capabilities, suitable for complex processing tasks.

DAC Channels: YES

Digital-to-analog converter channels enable the product to interface with analog components, expanding its range of uses.

Power Supplies (V): 1.8/3.3

Support for multiple power supplies allows for compatibility with different voltage requirements, enhancing versatility.

No. of Terminals: 80

Having a high number of terminals provides ample connection options for peripherals and external components.

Package Style (Meter): FLATPACK, FINE PITCH

Flatpack design with fine pitch enhances the product's compactness and enables dense PCB layouts.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability and performance under demanding environmental conditions.

CPU Family: CORTEX-M4

Belonging to the Cortex-M4 CPU family signifies advanced processing capabilities and high efficiency in task execution.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance allows for reliable performance in cold environments or during temperature fluctuations.

Terminal Finish: TIN

TIN terminal finish ensures good electrical conductivity and resistance to corrosion, maintaining signal integrity.

ADC Channels: YES

Analog-to-digital converter channels enable the product to process analog inputs, broadening its range of functionalities.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and enable the product to handle complex data processing tasks.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, reducing the risk of signal loss or interference.

ROM Words: 262144

Large ROM capacity allows for storing extensive program code and data, facilitating diverse application usage.

Width: 12 mm

Compact width dimensions enable space-saving integration in devices and PCB layouts, ideal for compact designs.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency ensures fast processing speeds and efficient execution of tasks, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 40

Capability to withstand peak reflow temperatures for extended periods ensures reliable soldering and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with standard soldering processes and reliability in assembly.

Length: 12 mm

Compact length dimensions complement width specifications, enabling space-efficient integration in compact device designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER

Belonging to the microcontroller category signifies versatile processing capabilities and multiple integrated peripherals for diverse application requirements.

RAM Bytes: 65536

Ample RAM capacity allows for efficient data storage and processing, enabling seamless multitasking and handling of large datasets.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminal form ensures secure soldering connections and facilitates easy PCB integration during assembly.

Maximum Supply Current: 39 mA

Low maximum supply current requirement ensures efficient power usage and reduced heat generation, ideal for low-power applications.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard voltage requirements in electronic systems.

PWM Channels: YES

Pulse-width modulation channels enable precise control of digital signals, making the product suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating of firmware and software, ensuring flexibility and adaptability to changing requirements.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging and compact PCB design, optimizing space utilization in electronic devices.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, requiring proper handling and storage practices to maintain product integrity.

Speed: 72 rpm

High speed capability enhances data processing and execution efficiency, contributing to overall system performance and responsiveness.

No. of I/O Lines: 39

A high number of I/O lines provide extensive connectivity options for interfacing with external devices and peripherals, enhancing versatility and functionality.

Technical Specifications

Microcontrollers MK51DX256CLK7 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

50 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

39

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

39 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Peripheral IC Type:

Trade Compliance

MK51DX256CLK7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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