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MK51DN512CMC10

NXP Semiconductors

MK51DN512CMC10 by NXP Semiconductors

NXP Semiconductors' MK51DN512CMC10 is a 32-bit microcontroller with Cortex-M4 CPU, offering 524288 ROM words and 131072 RAM bytes. It operates at a max clock frequency of 32 MHz, suitable for industrial applications requiring up to 75 I/O lines and featuring DAC, ADC, DMA channels.

Median Price

$11.866

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MK51DN512CMC10 by NXP Semiconductors
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Verical

USA . 8,700 parts In-Stock

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USA . 1,740 parts In-Stock

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Vyrian

USA . 4,249 parts In-Stock

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USA . 1,740 parts In-Stock

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Anansix

USA . 863 parts In-Stock

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Chip Stock

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Digiode

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Nova Conductors

Japan . 550 parts In-Stock

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Ampacity Inc.

Singapore . 1,549 parts In-Stock

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One Stop Electronics

USA . 1,630 parts In-Stock

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$31.000

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Corohmni

South Africa . 104 parts In-Stock

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Microchip USA

USA . 1,731 parts In-Stock

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Component Stockers USA

USA . 233 parts In-Stock

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iodParts Technologies Inc.

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Lixinc

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Authorized Procurement Solutions

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Perfect Parts

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Aranea Global

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Overview

Unlock the power of advanced technology with the MK51DN512CMC10 microcontroller by NXP Semiconductors. Designed with precision and expertise, this cutting-edge device boasts a wide range of applications in various industries. Offering unparalleled performance and reliability, this product provides customers with value, efficiency, and seamless integration into their projects. Experience the benefits of high-quality components and elevate your designs to new heights with the MK51DN512CMC10.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and ensures the package body can withstand various environmental conditions, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle a wide range of input voltages, providing flexibility in different power supply configurations.

Package Shape: SQUARE

The square package shape helps in efficient PCB layout and space utilization, making it suitable for compact electronic devices.

Bit Size: 32

A 32-bit processor allows for faster and more efficient processing of data, making the microcontroller suitable for applications requiring high computational power.

DAC Channels: YES

Digital-to-Analog Converter (DAC) channels allow the microcontroller to convert digital signals into analog outputs, enabling precise control of analog components in a system.

No. of Terminals: 121

Having a higher number of terminals provides more connectivity options, allowing for a greater degree of interfacing with peripheral devices and sensors.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage requirement enables the microcontroller to operate efficiently even with low-power sources, making it energy-efficient.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of up to 85°C ensures the microcontroller can function reliably in harsh environmental conditions.

CPU Family: CORTEX-M4

BELONGS TO THE HIGH PERFORMANCE CORTEX-M4 FAMILY, OFFERING SUPERIOR COMPUTING CAPABILITIES AND EFFICIENCY.

ADC Channels: YES

Analog-to-Digital Converter (ADC) channels allow the microcontroller to read analog signals from sensors or other devices, providing accurate data acquisition capabilities.

DMA Channels: YES

Direct Memory Access (DMA) channels enable faster data transfer between peripherals and memory without CPU intervention, improving overall system performance.

ROM Words: 524288

With a large ROM memory size, the microcontroller can store a significant amount of program data, enabling the implementation of complex algorithms and applications.

Width: 8 mm

Compact width dimension allows for space-saving on the PCB and facilitates integration into small form factor devices.

Maximum Clock Frequency: 32 MHz

High clock frequency capability of 32 MHz enables fast processing speed, making the microcontroller suitable for applications requiring quick response times.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in the microcontroller ensures efficient execution of instructions, leading to improved performance and power efficiency.

RAM Bytes: 131072

The generous amount of RAM allows for efficient data storage and processing, enabling the microcontroller to handle multitasking and complex computations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Maximum Supply Current: 77 mA

The low maximum supply current requirement indicates efficient power usage, minimizing power consumption and heat dissipation.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog components like motors and LEDs, offering versatility in system design.

ROM Programmability: FLASH

Flash memory technology allows for easy reprogramming of the ROM, enabling firmware updates and customization without requiring special programming equipment.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the microcontroller can withstand reflow soldering and has moderate sensitivity to moisture exposure during handling and storage.

No. of I/O Lines: 75

A higher number of I/O lines provide more interfacing options with external devices, sensors, and peripherals, enhancing the microcontroller's connectivity and versatility.

Technical Specifications

Microcontrollers MK51DN512CMC10 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

75

No. of Terminals:

121

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.52 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

77 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Peripheral IC Type:

Trade Compliance

MK51DN512CMC10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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