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MK51DN512CMD10

NXP Semiconductors

MK51DN512CMD10 by NXP Semiconductors

The NXP Semiconductors MK51DN512CMD10 is a 32-bit microcontroller with Cortex-M4 CPU family, featuring 144 terminals and 91 I/O lines. It operates at a clock frequency of up to 32 MHz, with DAC and ADC channels, as well as PWM functionality. Ideal for industrial applications requiring high-speed processing and multiple input/output capabilities.

Median Price

$13.270

Lifecycle Status

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9

In-Stock Inventory

1k+

MK51DN512CMD10 by NXP Semiconductors
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Chip1Stop

Japan . 85 parts In-Stock

1+ parts

$12.107

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85

$12.107

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Verical

USA . 800 parts In-Stock

1+ parts

$13.270

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800

$13.270

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Arrow

USA . 800 parts In-Stock

1+ parts

$15.940

100+ parts

$13.270

1k+ parts

$12.890

10k+ parts

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800

$15.940

$13.270

$12.890

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DigiKey

USA . 175 parts In-Stock

1+ parts

$22.120

100+ parts

$15.355

1k+ parts

$14.316

10k+ parts

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175

$22.120

$15.355

$14.316

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Rochester

USA . 34 parts In-Stock

1+ parts

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100+ parts

$12.490

1k+ parts

$11.180

10k+ parts

$10.520

34

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$12.490

$11.180

$10.520

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Digiode

USA . 3,076 parts In-Stock

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$11.502

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3,076

$11.502

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Vyrian

USA . 7,412 parts In-Stock

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7,412

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Anansix

USA . 624 parts In-Stock

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Nova Conductors

Japan . 26 parts In-Stock

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Ampacity Inc.

Singapore . 41 parts In-Stock

1+ parts

$8.760

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41

$8.760

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Corphita

USA . 2,028 parts In-Stock

1+ parts

$10.896

100+ parts

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2,028

$10.896

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AZTECH Wire

Italy . 7,412 parts In-Stock

1+ parts

$13.190

100+ parts

$12.670

1k+ parts

$12.410

10k+ parts

$12.170

7,412

$13.190

$12.670

$12.410

$12.170

Corohmni

South Africa . 80 parts In-Stock

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$38.019

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80

$38.019

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Microchip USA

USA . 2,392 parts In-Stock

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$41.379

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2,392

$41.379

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Argo Parts USA

USA . 4,842 parts In-Stock

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Continental Prestige Electronics

USA . 3,672 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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UNI Independent Distributors

Spain . 2,376 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 179 parts In-Stock

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Overview

Elevate your projects with the MK51DN512CMD10 by NXP Semiconductors, a top-tier microcontroller designed to deliver unparalleled performance and versatility. With cutting-edge technology from a renowned manufacturer like NXP, this device boasts exceptional quality and reliability for a wide range of applications. From industrial automation to consumer electronics, the MK51DN512CMD10 offers customers unmatched value, benefits, and advantages, ensuring seamless integration and optimal functionality in every project. Experience the difference with this high-quality microcontroller and unlock endless possibilities for innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external factors, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher power requirements and voltages, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square package shape allows for easier integration into circuit designs, optimizing space utilization and layout efficiency.

Bit Size: 32

A 32-bit architecture provides increased processing power and efficiency, enabling faster and more complex operations to be performed.

DAC Channels: YES

DAC channels allow for analog signals to be accurately generated, providing versatility for applications that require precise analog output.

Power Supplies (V): 1.8/3.3

Support for multiple power supply options (1.8V and 3.3V) enables flexibility in design and compatibility with a variety of voltage sources.

No. of Terminals: 144

With 144 terminals, this microcontroller offers a wide range of connectivity options for peripherals and external devices, enhancing its versatility and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style offers a compact and efficient form factor, ideal for space-constrained applications without compromising performance.

Minimum Supply Voltage: 1.71 V

A low minimum supply voltage of 1.71V allows for energy-efficient operation and compatibility with lower voltage systems, reducing power consumption.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand higher temperature environments, making it suitable for industrial applications.

CPU Family: CORTEX-M4

The Cortex-M4 CPU family offers high performance and energy efficiency, making it well-suited for a wide range of embedded applications requiring real-time processing.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40°C ensures reliable performance in harsh environments and extended durability in cold conditions.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the connections.

ADC Channels: YES

ADC channels allow for analog signals to be accurately sampled and converted into digital data, facilitating precise measurement and control in various applications.

DMA Channels: YES

DMA channels enable data transfer between peripherals and memory without CPU intervention, improving system efficiency and performance for high-speed data processing.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, optimizing space utilization and ensuring convenient placement in the circuit design.

ROM Words: 524288

With a ROM capacity of 524,288 words, this microcontroller offers ample storage for program code and data, supporting complex applications and extensive functionality.

Maximum Seated Height: 1.7 mm

A low maximum seated height of 1.7mm enables slim and compact designs, reducing overall product dimensions and allowing for more streamlined integration.

Width: 13 mm

With a width of 13mm, this microcontroller can fit into narrow spaces and PCB layouts, maximizing flexibility in design and ensuring efficient use of available space.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32MHz enables high-speed processing and real-time operations, making this microcontroller suitable for applications demanding rapid task execution.

Maximum Time At Peak Reflow Temperature (s): 40

The ability to withstand peak reflow temperatures for 40 seconds ensures robust soldering and reliable connections during assembly, enhancing product durability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260°C allows for effective soldering and rework processes, ensuring secure and long-lasting connections for the microcontroller.

Length: 13 mm

With a length of 13mm, this microcontroller offers a compact form factor suitable for space-constrained applications, without compromising on performance or functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications ensure reliable operation in harsh environmental conditions and demanding applications, making this microcontroller suitable for industrial use.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers efficient and streamlined processing, enabling quick execution of instructions and optimal performance for embedded applications.

RAM Bytes: 131072

With 131,072 bytes of RAM, this microcontroller provides ample memory for data storage and manipulation, supporting multitasking and complex computing requirements smoothly.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable operation, making this microcontroller energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form facilitates reliable soldering connections, ensuring secure attachment to the PCB and enhancing overall durability and performance of the microcontroller.

Maximum Supply Current: 77 mA

With a maximum supply current of 77mA, this microcontroller operates efficiently and with low power consumption, making it suitable for battery-powered and energy-conscious devices.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V ensures stable and reliable operation, providing consistent performance and compatibility with standard voltage levels in many applications.

PWM Channels: YES

PWM channels allow for precise control of the output signal duty cycle, enabling accurate analog signal generation and facilitating motor control and power management tasks.

ROM Programmability: FLASH

ROM programmability with FLASH technology allows for easy and quick reprogramming of the memory, enabling flexibility in application development and firmware updates.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, this microcontroller offers compatibility with standard PCB layouts and connectors, ensuring easy integration and reliable connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that this microcontroller has moderate moisture sensitivity, requiring standard handling and storage procedures to maintain optimal performance and reliability.

Speed: 100 rpm

Operating at a speed of 100rpm, this microcontroller can process instructions and data at a rapid pace, enabling efficient and responsive performance in various applications.

No. of I/O Lines: 91

With 91 I/O lines, this microcontroller offers ample connectivity for interfacing with external devices and peripherals, providing flexibility and versatility for diverse application requirements.

Technical Specifications

Microcontrollers MK51DN512CMD10 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

91

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.7 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

77 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

13 mm

Peripheral IC Type:

Trade Compliance

MK51DN512CMD10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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