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MC9S12XEP100CAG

NXP Semiconductors

MC9S12XEP100CAG by NXP Semiconductors

MC9S12XEP100CAG by NXP is a 32-bit microcontroller with 23-bit address bus, operating at max 40 MHz. Ideal for industrial applications, it features 144 terminals, ADC and DMA channels, and ROM programmability in a compact square package.

Median Price

$37.170

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

MC9S12XEP100CAG by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 78 parts In-Stock

1+ parts

$29.420

100+ parts

$19.350

1k+ parts

-

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78

$29.420

$19.350

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Chip1Stop

Japan . 100 parts In-Stock

1+ parts

$34.700

100+ parts

$27.100

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-

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100

$34.700

$27.100

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Arrow

USA . 170 parts In-Stock

1+ parts

$36.620

100+ parts

$27.520

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-

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170

$36.620

$27.520

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Newark

USA . 19 parts In-Stock

1+ parts

$37.170

100+ parts

$27.310

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19

$37.170

$27.310

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Mouser Electronics

USA . 938 parts In-Stock

1+ parts

$44.910

100+ parts

$32.780

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938

$44.910

$32.780

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DigiKey

USA . 344 parts In-Stock

1+ parts

$45.040

100+ parts

$32.487

1k+ parts

$31.227

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344

$45.040

$32.487

$31.227

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Verical

USA . 180 parts In-Stock

1+ parts

$48.741

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180

$48.741

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Element14

Singapore . 9 parts In-Stock

1+ parts

$64.370

100+ parts

$48.070

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9

$64.370

$48.070

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RS (Exports)

UK . 586 parts In-Stock

1+ parts

-

100+ parts

$20.864

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586

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$20.864

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EBV Elektronik

Germany . 300 parts In-Stock

1+ parts

-

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300

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$26.070

100+ parts

-

1k+ parts

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870

$26.070

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Digiode

USA . 3,072 parts In-Stock

1+ parts

$27.949

100+ parts

-

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3,072

$27.949

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Maritex

Poland . 600 parts In-Stock

1+ parts

$73.567

100+ parts

$47.205

1k+ parts

$35.258

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600

$73.567

$47.205

$35.258

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Chip Stock

USA . 4,100 parts In-Stock

1+ parts

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4,100

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Cyclops Electronics Ltd

UK . 300 parts In-Stock

1+ parts

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300

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Anansix

USA . 213 parts In-Stock

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213

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ComSIT Distribution GmbH

Germany . 30 parts In-Stock

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30

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Next Level Components, LLC

USA . 27 parts In-Stock

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27

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J2 Sourcing AB

Sweden . 23 parts In-Stock

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23

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Vyrian

USA . 12 parts In-Stock

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12

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ACDS - Activité Composants Distribution Service

France . 4 parts In-Stock

1+ parts

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4

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Prism Electronics

USA . 2 parts In-Stock

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2

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Microfarads

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 110 parts In-Stock

1+ parts

$17.730

100+ parts

-

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110

$17.730

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Netroflash

USA . 100 parts In-Stock

1+ parts

$26.070

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-

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100

$26.070

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Corohmni

South Africa . 510 parts In-Stock

1+ parts

$26.072

100+ parts

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510

$26.072

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Corphita

USA . 3,868 parts In-Stock

1+ parts

$26.478

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3,868

$26.478

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Continental Prestige Electronics

USA . 249 parts In-Stock

1+ parts

$28.280

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249

$28.280

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Semicontronic

India . 72 parts In-Stock

1+ parts

$38.600

100+ parts

$37.635

1k+ parts

$37.442

10k+ parts

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72

$38.600

$37.635

$37.442

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Aztec Data Supply Inc.

USA . 1,070 parts In-Stock

1+ parts

$60.886

100+ parts

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1,070

$60.886

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Microchip USA

USA . 1,940 parts In-Stock

1+ parts

$79.948

100+ parts

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1,940

$79.948

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Lixinc

USA . 19,511 parts In-Stock

1+ parts

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19,511

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UNI Independent Distributors

Spain . 3,747 parts In-Stock

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3,747

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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Argo Parts USA

USA . 2,137 parts In-Stock

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2,137

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GreenTree Electronics

Israel . 660 parts In-Stock

1+ parts

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660

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Perfect Parts

USA . 365 parts In-Stock

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365

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Authorized Procurement Solutions

USA . 250 parts In-Stock

1+ parts

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100+ parts

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250

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Overview

Unlock endless possibilities with the MC9S12XEP100CAG by NXP Semiconductors, a leading name in the industry. As a top-tier microcontroller, this cutting-edge device offers unparalleled performance and reliability for a wide range of applications. Whether you're designing innovative IoT devices or advanced automotive systems, this product delivers unmatched value, efficiency, and flexibility. Trust NXP Semiconductors to take your projects to the next level with the MC9S12XEP100CAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.98 V

Works efficiently within a low voltage range, reducing power consumption.

Package Shape: SQUARE

Helps in optimizing space on the circuit board and allows for efficient layout designs.

Power Supplies (V): 3.3/5

Supports multiple power supply options, making it versatile for different applications.

No. of Terminals: 144

Provides ample connectivity options for interfacing with other components.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments, ensuring reliable performance in any conditions.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing architecture for efficient processing and better performance.

ROM Programmability: FLASH

Enables the microcontroller's ROM to be reprogrammed, making it flexible for future updates and iterations.

Technical Specifications

Microcontrollers MC9S12XEP100CAG attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

IT ALSO REQUIRES 5 V I/O SUPPLY

Address Bus Width:

23

Bit Size:

32

CPU Family:

CPU12

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

119

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.72 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MC9S12XEP100CAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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