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MC9S12XDP512MAG

NXP Semiconductors

MC9S12XDP512MAG by NXP Semiconductors

MC9S12XDP512MAG by NXP Semiconductors is a 16-bit microcontroller with 144 terminals, operating at up to 80 MHz. It features 32768 bytes of RAM, ADC and DMA channels, and flash ROM programmability. Widely used in automotive applications due to its temperature grade of -40 to 125 °C and low profile flatpack package style.

Median Price

$43.890

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Arrow

USA . 300 parts In-Stock

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$43.890

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$36.200

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$43.890

$36.200

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Verical

USA . 300 parts In-Stock

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$43.890

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$36.200

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$43.890

$36.200

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Mouser Electronics

USA . 130 parts In-Stock

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$58.010

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$42.410

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130

$58.010

$42.410

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DigiKey

USA . 457 parts In-Stock

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$58.020

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$42.402

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Future Electronics

Canada . 1,800 parts In-Stock

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$32.380

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Avnet

USA . 180 parts In-Stock

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Rochester

USA . 42 parts In-Stock

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$35.620

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$31.870

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$29.990

42

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$31.870

$29.990

Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

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$35.990

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$35.990

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Digiode

USA . 2,947 parts In-Stock

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$43.643

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Vyrian

USA . 5,494 parts In-Stock

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Chip Stock

USA . 3,000 parts In-Stock

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IBS Electronics

USA . 1,800 parts In-Stock

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$49.957

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Anansix

USA . 1,560 parts In-Stock

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NAC Semi

USA . 600 parts In-Stock

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$44.140

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$44.140

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TME

Poland . 200 parts In-Stock

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$48.340

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$48.340

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Flip Electronics

USA . 42 parts In-Stock

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R&J Components

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AZTECH Wire

Italy . 480 parts In-Stock

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$16.669

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$16.669

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Ampacity Inc.

Singapore . 306 parts In-Stock

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$25.240

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$25.240

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Semicontronic

India . 222 parts In-Stock

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$25.240

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$24.609

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$24.483

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$25.240

$24.609

$24.483

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Continental Prestige Electronics

USA . 6,558 parts In-Stock

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$35.210

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$34.506

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$35.210

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Netroflash

USA . 1,000 parts In-Stock

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$35.990

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$34.191

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$33.471

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$35.990

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$33.471

Corohmni

South Africa . 171 parts In-Stock

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$35.992

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$37.072

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$35.218

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$35.218

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$37.072

$35.218

$35.218

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Aztec Data Supply Inc.

USA . 4,334 parts In-Stock

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$39.090

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Corphita

USA . 3,610 parts In-Stock

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Microchip USA

USA . 1,442 parts In-Stock

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Lixinc

USA . 17,759 parts In-Stock

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iodParts Technologies Inc.

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UNI Independent Distributors

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Argo Parts USA

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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Perfect Parts

USA . 375 parts In-Stock

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Futuretech Components

Singapore . 280 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the MC9S12XDP512MAG microcontroller from NXP Semiconductors. This cutting-edge device offers unparalleled performance and reliability, making it ideal for a wide range of applications. With its advanced features and high-quality construction, this microcontroller provides excellent value and benefits to customers looking to take their projects to the next level. Experience the difference that NXP Semiconductors can make in your designs with the MC9S12XDP512MAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for smaller form factor and easier assembly, making the product more efficient and cost-effective.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75V ensures safe operation and prevents damage to the microcontroller.

Package Shape: SQUARE

The square shape provides a symmetrical design for easier PCB layout and integration into electronic systems.

Bit Size: 16

With a 16-bit size, the microcontroller can process data and instructions with higher precision and efficiency.

Power Supplies (V): 2.5,5

Support for multiple power supply voltages allows flexibility in design and compatibility with different power sources.

No. of Terminals: 144

Having 144 terminals provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style enables a compact design, low profile for space-constrained applications, and fine pitch for high-density mounting.

Minimum Supply Voltage: 2.35 V

The minimum supply voltage of 2.35V ensures reliable operation even under low voltage conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the microcontroller can withstand harsh environmental conditions.

CPU Family: CPU12

The CPU12 family offers advanced features and performance for demanding embedded applications.

Minimum Operating Temperature: -40 °C

The microcontroller can operate in extreme cold temperatures down to -40°C, making it suitable for automotive and industrial applications.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and performance in data-intensive applications.

Terminal Position: QUAD

Quad terminal position offers multiple connection points for increased flexibility in PCB design and layout.

ROM Words: 524288

The large ROM capacity of 524288 words allows for storing a significant amount of program code and data.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6mm enables slim and compact device designs.

Width: 20 mm

With a width of 20mm, the microcontroller can fit into small spaces and tight layouts.

Maximum Clock Frequency: 80 MHz

A high maximum clock frequency of 80MHz enables fast and efficient processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 40

The microcontroller can withstand peak reflow temperatures for up to 40 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microcontroller can be soldered using standard reflow techniques.

Length: 20 mm

The length of 20mm offers a compact form factor for easy integration into various electronic devices.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature range ensures reliable operation in automotive applications subjected to extreme temperatures.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates multiple peripherals and processing capabilities into a single chip, reducing system complexity.

RAM Bytes: 32768

The 32768 bytes of RAM provide ample memory for data storage and manipulation during real-time processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form allows for easy automated assembly and soldering, streamlining the manufacturing process.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V ensures stable and efficient operation of the microcontroller.

PWM Channels: YES

Pulse-width modulation channels offer precise control over output signals, making the microcontroller suitable for motor control and power management applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updating and reprogramming of firmware, enhancing the flexibility and longevity of the product.

Terminal Pitch: 0.5 mm

With a narrow terminal pitch of 0.5mm, the microcontroller can be densely packed on a PCB, saving space and reducing footprint.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling.

Speed: 40 rpm

The 40 revolutions per minute speed specification may not directly apply to a microcontroller, but it could be indicative of a related application or feature.

No. of I/O Lines: 119

With 119 I/O lines, the microcontroller offers extensive input and output capabilities for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MC9S12XDP512MAG attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

IT ALSO REQUIRES 5 V SUPPLY

Address Bus Width:

0

Bit Size:

16

CPU Family:

CPU12

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

119

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,5

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MC9S12XDP512MAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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