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MC9S12XDP512MAG,557

NXP Semiconductors

MC9S12XDP512MAG,557 by NXP Semiconductors

MC9S12XDP512MAG,557 by NXP is a 16-bit microcontroller with 144 terminals, operating at max 16 MHz clock frequency. It features ADC and DMA channels, ROM programmability via FLASH, and 119 I/O lines. Suitable for applications requiring low-profile, fine-pitch package style in CMOS technology.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

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$1.000

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38

$1.000

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Digiode

USA . 3,777 parts In-Stock

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3,777

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Vyrian

USA . 1,225 parts In-Stock

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1,225

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Anansix

USA . 462 parts In-Stock

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462

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,809 parts In-Stock

1+ parts

$1.000

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$0.980

5,809

$1.000

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$0.980

Argo Parts USA

USA . 2,680 parts In-Stock

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$1.000

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2,680

$1.000

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Netroflash

USA . 50 parts In-Stock

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$1.000

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$0.950

10k+ parts

$0.930

50

$1.000

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$0.950

$0.930

Ampacity Inc.

Singapore . 1,067 parts In-Stock

1+ parts

$2.000

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1,067

$2.000

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AZTECH Wire

Italy . 384 parts In-Stock

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$13.129

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384

$13.129

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Corohmni

South Africa . 403 parts In-Stock

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$27.635

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403

$27.635

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One Stop Electronics

USA . 1,005 parts In-Stock

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$31.000

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1,005

$31.000

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Semicontronic

India . 469 parts In-Stock

1+ parts

$31.000

100+ parts

$30.225

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$30.070

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469

$31.000

$30.225

$30.070

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Microchip USA

USA . 2,866 parts In-Stock

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$58.136

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2,866

$58.136

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UNI Independent Distributors

Spain . 1,914 parts In-Stock

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Corphita

USA . 789 parts In-Stock

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789

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Overview

Unlock the power of innovation with the MC9S12XDP512MAG,557 by NXP Semiconductors. This cutting-edge microcontroller offers unparalleled quality and reliability, making it perfect for a wide range of applications. With advanced features like ADC and DMA channels, PWM channels, and ROM programmability, this product provides exceptional value and benefits to customers. Experience seamless performance and efficiency with NXP Semiconductors' unmatched expertise in semiconductor technology. Elevate your projects with the MC9S12XDP512MAG,557 and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material makes the microcontroller lightweight and durable, ensuring long-lasting performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto a circuit board, saving space and facilitating mass production.

Maximum Supply Voltage: 2.75 V

Having a maximum supply voltage of 2.75 V ensures safe operation and prevents damage due to overvoltage situations.

Package Shape: SQUARE

Square package shape provides uniformity and ease of mounting, simplifying the integration of the microcontroller into electronic devices.

Bit Size: 16

16-bit architecture allows for higher processing capabilities and efficiency in handling data and calculations.

No. of Terminals: 144

Having 144 terminals enables the microcontroller to connect to various external components and peripherals, expanding its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving advantages and facilitates dense circuit board designs.

Minimum Supply Voltage: 2.35 V

A minimum supply voltage of 2.35 V ensures stable operation at lower power levels, optimizing energy efficiency.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows the microcontroller to read and process analog signals, enabling sensor interfacing and data acquisition.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer speeds and offload the CPU, improving overall system performance.

Terminal Position: QUAD

Quad terminal position provides secure connections and better heat dissipation, ensuring reliability in demanding operating conditions.

Maximum Seated Height: 1.6 mm

A low maximum seated height of 1.6 mm allows for compact device designs and efficient heat dissipation, enhancing overall system performance.

Width: 20 mm

A width of 20 mm offers a balance between compactness and ease of handling during integration and assembly processes.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, the microcontroller can execute instructions at a rapid pace, enabling real-time processing of data and signals.

Length: 20 mm

A length of 20 mm contributes to a compact form factor, allowing for versatile installation in space-constrained applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product is designed to handle various input/output operations, offering versatile control and processing capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring efficient and reliable operation in diverse environments.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint strength and mechanical stability, contributing to the long-term reliability of the microcontroller.

Nominal Supply Voltage: 2.5 V

Having a nominal supply voltage of 2.5 V ensures compatibility with standard power sources, simplifying integration into various electronic systems.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of output signals, making the microcontroller suitable for applications requiring motor control or LED dimming.

ROM Programmability: FLASH

ROM programmability using Flash memory allows for easy reprogramming of the microcontroller's firmware, facilitating firmware updates and customization.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm offers high-density interconnection capabilities, enabling compact circuit layouts and reducing overall system size.

Speed: 80 rpm

Operating at a speed of 80 rpm, the microcontroller can execute tasks efficiently, meeting the processing demands of various applications.

No. of I/O Lines: 119

Having 119 input/output lines allows the microcontroller to interface with a wide range of external devices and peripherals, expanding its connectivity and functionality.

Technical Specifications

Microcontrollers MC9S12XDP512MAG,557 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

IT ALSO REQUIRES 5 V SUPPLY

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of I/O Lines:

119

No. of Terminals:

144

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.35 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MC9S12XDP512MAG,557 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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