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MC9S08DZ48AMLH

NXP Semiconductors

MC9S08DZ48AMLH by NXP Semiconductors

MC9S08DZ48AMLH by NXP is an 8-bit microcontroller with a max clock frequency of 16 MHz, suitable for industrial applications. It features 54 I/O lines, 2 serial I/Os, and 8 timers. With low power mode and PWM channels, it operates at temperatures ranging from -40 to 85°C.

Median Price

$10.620

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.361

10k+ parts

-

9,600

-

-

$10.361

-

Rochester

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$10.880

1k+ parts

$9.730

10k+ parts

$9.160

160

-

$10.880

$9.730

$9.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,972 parts In-Stock

1+ parts

$9.566

100+ parts

-

1k+ parts

-

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-

4,972

$9.566

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-

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Vyrian

USA . 2,934 parts In-Stock

1+ parts

-

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2,934

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-

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Anansix

USA . 2,869 parts In-Stock

1+ parts

-

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2,869

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 753 parts In-Stock

1+ parts

$8.320

100+ parts

-

1k+ parts

-

10k+ parts

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753

$8.320

-

-

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Corphita

USA . 3,870 parts In-Stock

1+ parts

$9.063

100+ parts

-

1k+ parts

-

10k+ parts

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3,870

$9.063

-

-

-

Component Stockers USA

USA . 99 parts In-Stock

1+ parts

$10.340

100+ parts

$9.720

1k+ parts

-

10k+ parts

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99

$10.340

$9.720

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-

Microchip USA

USA . 6,955 parts In-Stock

1+ parts

$31.400

100+ parts

$30.950

1k+ parts

$30.730

10k+ parts

$30.500

6,955

$31.400

$30.950

$30.730

$30.500

UNI Independent Distributors

Spain . 4,531 parts In-Stock

1+ parts

-

100+ parts

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4,531

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Continental Prestige Electronics

USA . 160 parts In-Stock

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160

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Overview

Experience the power and precision of the MC9S08DZ48AMLH microcontroller by NXP Semiconductors, a leading manufacturer in the industry. This versatile device offers a wide range of applications in various fields, providing exceptional quality and reliability. With its low power mode and high clock frequency, this product delivers unmatched performance while offering value and benefits to customers looking for advanced control solutions. Upgrade your projects with the MC9S08DZ48AMLH and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material ensures durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount technology makes it easier for automated assembly processes, reducing production costs and improving reliability.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, increasing compatibility.

Package Shape: SQUARE

The square package shape allows for efficient use of space on circuit boards, optimizing layout and design.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost, suitable for many general-purpose applications.

No. of Terminals: 64

Having 64 terminals allows for a greater number of connectivity options with external devices, enhancing versatility.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage enables power efficiency and extends the range of compatible power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and high-performance applications.

CPU Family: HCS08

Being part of the HCS08 CPU family ensures compatibility and support with a range of tools and software development resources.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for reliable operation in extreme cold environments, increasing the microcontroller's versatility.

Technical Specifications

Microcontrollers MC9S08DZ48AMLH attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

HCS08

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Current:

24 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MC9S08DZ48AMLH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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