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MC9S08DV32ACLH

NXP Semiconductors

MC9S08DV32ACLH by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

$12.214

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$12.510

10k+ parts

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800

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$12.510

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Flip Electronics (Authorized)

USA . 800 parts In-Stock

1+ parts

-

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-

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800

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Verical

USA . 800 parts In-Stock

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1k+ parts

$11.919

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800

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$11.919

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,153 parts In-Stock

1+ parts

-

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Digiode

USA . 1,688 parts In-Stock

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Anansix

USA . 1,556 parts In-Stock

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Flip Electronics

USA . 1,280 parts In-Stock

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1,280

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 6,153 parts In-Stock

1+ parts

$4.540

100+ parts

$4.360

1k+ parts

$4.270

10k+ parts

$4.190

6,153

$4.540

$4.360

$4.270

$4.190

One Stop Electronics

USA . 683 parts In-Stock

1+ parts

$13.000

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683

$13.000

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Microchip USA

USA . 1,833 parts In-Stock

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$25.606

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$25.606

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$56.531

100+ parts

$55.966

1k+ parts

$53.704

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200

$56.531

$55.966

$53.704

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Component Stockers USA

USA . 1,056 parts In-Stock

1+ parts

$83.970

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1,056

$83.970

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QUARKTWIN TECHNOLOGY LTD

USA . 29,919 parts In-Stock

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29,919

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UNI Independent Distributors

Spain . 3,532 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Corphita

USA . 2,723 parts In-Stock

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2,723

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Technical Specifications

Microcontrollers MC9S08DV32ACLH attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MC9S08DV32ACLH Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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