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MC9S08AC16CFDE

NXP Semiconductors

MC9S08AC16CFDE by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$9.075

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,300 parts In-Stock

1+ parts

$10.930

100+ parts

$7.281

1k+ parts

$6.780

10k+ parts

-

1,300

$10.930

$7.281

$6.780

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Flip Electronics (Authorized)

USA . 1,326 parts In-Stock

1+ parts

-

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1,326

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Rochester

USA . 850 parts In-Stock

1+ parts

-

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$4.800

1k+ parts

$4.290

10k+ parts

$4.040

850

-

$4.800

$4.290

$4.040

Verical

USA . 800 parts In-Stock

1+ parts

-

100+ parts

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$9.075

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800

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$9.075

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EBV Elektronik

Germany . 260 parts In-Stock

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260

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Distributors (In-Stock)

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Digiode

USA . 2,214 parts In-Stock

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$4.218

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2,214

$4.218

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Vyrian

USA . 4,057 parts In-Stock

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$4.440

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R&J Components

USA . 1,280 parts In-Stock

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1,280

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Anansix

USA . 1,071 parts In-Stock

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Flip Electronics

USA . 866 parts In-Stock

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866

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Martec Srl

Italy . 458 parts In-Stock

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TME

Poland . 260 parts In-Stock

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$7.670

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260

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$7.670

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ComSIT Distribution GmbH

Germany . 52 parts In-Stock

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52

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Nova Conductors

Japan . 22 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 372 parts In-Stock

1+ parts

$3.770

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372

$3.770

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Corphita

USA . 2,787 parts In-Stock

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$3.996

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$3.996

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Corohmni

South Africa . 17 parts In-Stock

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$16.392

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17

$16.392

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Modulus Dynamics

Lithuania . 1,535 parts In-Stock

1+ parts

$59.305

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$59.305

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$59.305

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1,535

$59.305

$59.305

$59.305

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QUARKTWIN TECHNOLOGY LTD

USA . 29,419 parts In-Stock

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Microchip USA

USA . 8,712 parts In-Stock

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Continental Prestige Electronics

USA . 4,539 parts In-Stock

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Perfect Parts

USA . 4,077 parts In-Stock

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4,077

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iodParts Technologies Inc.

India . 3,226 parts In-Stock

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Argo Parts USA

USA . 1,343 parts In-Stock

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1,343

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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UNI Independent Distributors

Spain . 852 parts In-Stock

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Technical Specifications

Microcontrollers MC9S08AC16CFDE attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES WITH 5V NOMINAL SUPPLY

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XBCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

38

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18.5 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MC9S08AC16CFDE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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