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MC912DG128AMPVE

NXP Semiconductors

MC912DG128AMPVE by NXP Semiconductors

MC912DG128AMPVE by NXP Semiconductors is a 16-bit microcontroller with 112 terminals, operating at up to 16 MHz clock frequency. Ideal for automotive applications, it features a flash ROM, 83 I/O lines, and PWM channels for versatile control in compact spaces.

Median Price

$62.251

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$62.251

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9,900

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-

$62.251

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,128 parts In-Stock

1+ parts

$71.240

100+ parts

-

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2,128

$71.240

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Vyrian

USA . 2,581 parts In-Stock

1+ parts

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2,581

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Anansix

USA . 1,463 parts In-Stock

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1,463

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Flip Electronics

USA . 180 parts In-Stock

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180

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Pegasus Components GmbH

Germany . 45 parts In-Stock

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45

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Rebound Electronics

UK . 40 parts In-Stock

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40

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Sea View Technologies

USA . 1 parts In-Stock

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1

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Bristol Electronics

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 2,581 parts In-Stock

1+ parts

$32.270

100+ parts

$30.990

1k+ parts

$30.370

10k+ parts

$29.760

2,581

$32.270

$30.990

$30.370

$29.760

Corohmni

South Africa . 230 parts In-Stock

1+ parts

$53.463

100+ parts

-

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230

$53.463

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One Stop Electronics

USA . 244 parts In-Stock

1+ parts

$63.740

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244

$63.740

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Ampacity Inc.

Singapore . 244 parts In-Stock

1+ parts

$63.740

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244

$63.740

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Corphita

USA . 477 parts In-Stock

1+ parts

$67.491

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477

$67.491

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Component Stockers USA

USA . 222 parts In-Stock

1+ parts

$74.340

100+ parts

$60.720

1k+ parts

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222

$74.340

$60.720

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Vigor

Singapore . 7,284 parts In-Stock

1+ parts

$78.290

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7,284

$78.290

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Microchip USA

USA . 1,017 parts In-Stock

1+ parts

$127.080

100+ parts

$124.870

1k+ parts

$123.760

10k+ parts

$122.660

1,017

$127.080

$124.870

$123.760

$122.660

Authorized Procurement Solutions

USA . 7,500 parts In-Stock

1+ parts

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7,500

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UNI Independent Distributors

Spain . 1,237 parts In-Stock

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1,237

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Perfect Parts

USA . 136 parts In-Stock

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136

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Unleash the power of cutting-edge technology with the MC912DG128AMPVE by NXP Semiconductors, a top-tier manufacturer renowned for superior quality and reliability. As a versatile microcontroller, this product offers endless possibilities in automotive applications, ensuring optimal performance and efficiency. Benefit from its advanced features, seamless integration, and robust design to elevate your projects to new heights. Experience innovation at its finest with the MC912DG128AMPVE - the ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of electronic components, making the microcontroller suitable for mass production.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this microcontroller can be used in a wide range of applications without risking damage from overvoltage.

Address Bus Width: 16

A wider address bus allows for larger memory addressing capabilities, making the microcontroller suitable for applications requiring extensive memory usage.

No. of Terminals: 112

Having a high number of terminals provides flexibility in connecting external components and peripherals, making the microcontroller versatile for different applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the microcontroller can function reliably even in high-temperature environments like automotive applications.

ADC Channels: YES

Analog-to-digital converter (ADC) channels allow the microcontroller to interface with analog sensors, making it suitable for applications that require sensor data acquisition.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed for embedded systems, offering a combination of processing power and peripheral interfaces suitable for a wide range of applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible programming of the microcontroller's memory, enabling quick updates and modifications to the firmware.

Technical Specifications

Microcontrollers MC912DG128AMPVE attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G112

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

83

No. of Terminals:

112

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

HCMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

MC912DG128AMPVE Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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