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MC34PF3001A3EPR2

NXP Semiconductors

MC34PF3001A3EPR2 by NXP Semiconductors

MC34PF3001A3EPR2 by NXP Semiconductors is a 48-terminal Power Management IC with Vsup range of 2.8V to 4.5V, operating from -40°C to 105°C. It features 10 channels, adjustable threshold, and is ideal for industrial applications requiring surface mount square package with 0.5mm terminal pitch.

Median Price

$4.077

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 8,000 parts In-Stock

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$4.077

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Vyrian

USA . 3,101 parts In-Stock

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Digiode

USA . 2,875 parts In-Stock

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Anansix

USA . 1,273 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 13,522 parts In-Stock

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$3.610

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One Stop Electronics

USA . 952 parts In-Stock

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$4.500

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952

$4.500

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Ampacity Inc.

Singapore . 328 parts In-Stock

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$7.500

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328

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AZTECH Wire

Italy . 445 parts In-Stock

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$11.735

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Corohmni

South Africa . 252 parts In-Stock

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$24.017

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252

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Microchip USA

USA . 5,799 parts In-Stock

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$26.503

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Lixinc

USA . 17,729 parts In-Stock

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UNI Independent Distributors

Spain . 5,703 parts In-Stock

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Corphita

USA . 3,401 parts In-Stock

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Continental Prestige Electronics

USA . 3,089 parts In-Stock

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Futuretech Components

Singapore . 1,820 parts In-Stock

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Argo Parts USA

USA . 794 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Discover the cutting-edge MC34PF3001A3EPR2 by NXP Semiconductors, a top-tier manufacturer known for their superior quality and reliability. This Power Management IC is a game-changer in its category, offering unmatched performance and efficiency. With a wide range of applications, this product provides exceptional value to customers looking for seamless power supply support circuitry. Trust NXP Semiconductors to deliver innovative solutions that exceed your expectations.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on the surface of a PCB, making it suitable for compact and space-constrained designs.

Nominal Supply Voltage (Vsup): 3.6 V

Stable supply voltage ensures consistent performance and reliability of the power management circuit.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance ensures the product can withstand harsh environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows the product to perform effectively in both extreme cold and hot conditions.

No. of Channels: 10

Multiple channels enable the product to handle a larger number of power supply connections efficiently, making it suitable for complex systems.

Technical Specifications

Power Management ICs MC34PF3001A3EPR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Additional Features:

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7 mm

Trade Compliance

MC34PF3001A3EPR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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