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MC34PF3001A3EP

NXP Semiconductors

MC34PF3001A3EP by NXP Semiconductors

MC34PF3001A3EP by NXP Semiconductors is a 48-terminal Power Management IC with a nominal voltage of 3.6V, suitable for industrial applications. It features a max operating temperature of 105°C and surface mount capability in a square package shape, making it ideal for power supply support circuits requiring precise voltage regulation.

Median Price

$6.957

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 104 parts In-Stock

1+ parts

$6.950

100+ parts

$4.940

1k+ parts

-

10k+ parts

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104

$6.950

$4.940

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Arrow

USA . 6,006 parts In-Stock

1+ parts

$6.964

100+ parts

$4.677

1k+ parts

$3.989

10k+ parts

$3.710

6,006

$6.964

$4.677

$3.989

$3.710

Mouser Electronics

USA . 35 parts In-Stock

1+ parts

$9.240

100+ parts

$6.070

1k+ parts

$5.040

10k+ parts

$4.850

35

$9.240

$6.070

$5.040

$4.850

Verical

USA . 6,006 parts In-Stock

1+ parts

-

100+ parts

$4.677

1k+ parts

$3.989

10k+ parts

$3.710

6,006

-

$4.677

$3.989

$3.710

Distrelec

Netherlands . 519 parts In-Stock

1+ parts

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519

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Distributors (In-Stock)

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Digiode

USA . 1,312 parts In-Stock

1+ parts

$6.289

100+ parts

-

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1,312

$6.289

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Vyrian

USA . 7,190 parts In-Stock

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7,190

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Anansix

USA . 2,796 parts In-Stock

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2,796

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Chip Stock

USA . 644 parts In-Stock

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644

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,424 parts In-Stock

1+ parts

$3.910

100+ parts

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1,424

$3.910

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Corphita

USA . 2,943 parts In-Stock

1+ parts

$5.958

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2,943

$5.958

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Corohmni

South Africa . 514 parts In-Stock

1+ parts

$7.216

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514

$7.216

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Aztec Data Supply Inc.

USA . 4,212 parts In-Stock

1+ parts

$13.460

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4,212

$13.460

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Microchip USA

USA . 1,865 parts In-Stock

1+ parts

$20.888

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1,865

$20.888

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iodParts Technologies Inc.

India . 8,029 parts In-Stock

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8,029

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Continental Prestige Electronics

USA . 6,447 parts In-Stock

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UNI Independent Distributors

Spain . 2,721 parts In-Stock

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Perfect Parts

USA . 2,038 parts In-Stock

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2,038

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Argo Parts USA

USA . 1,343 parts In-Stock

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1,343

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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A-Z Elektronik GmbH

Germany . 150 parts In-Stock

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150

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Overview

Enhance your power management capabilities with the MC34PF3001A3EP by NXP Semiconductors. This high-quality Power Management IC boasts a wide range of applications, from industrial to consumer electronics. With its innovative design and reliable performance, this product ensures efficient power supply support for your devices. Experience the value and benefits of this versatile solution, featuring surface mount capability and a square package shape. Trust NXP Semiconductors for top-notch semiconductor technology that delivers exceptional results in a compact and efficient package. Upgrade your power management systems with the MC34PF3001A3EP today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square shape provides a compact footprint, ideal for applications with limited space availability.

Nominal Supply Voltage (Vsup): 3.6 V

Optimized voltage for efficient power management, suitable for a wide range of electronic devices.

No. of Terminals: 48

Ample terminals for connecting various components, offering flexibility in circuit design and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package style ensures efficient heat dissipation and reduced overall size, ideal for high-performance applications.

Maximum Operating Temperature: 105 °C

High operating temperature range allows for reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operation in extreme cold conditions, increasing versatility.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: QUAD

Quad terminal position facilitates easier soldering and board layout, enhancing installation efficiency.

Maximum Seated Height: 0.9 mm

Low-profile design saves space and allows for compact device construction.

Width (mm): 7 mm

Slim width enables integration into space-constrained applications, ideal for compact designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed to support power supply functions, ensuring stable and efficient power delivery.

Minimum Supply Voltage (Vsup): 2.8 V

Low minimum voltage requirement allows for operation with a wide range of power sources, increasing compatibility.

Maximum Time At Peak Reflow Temperature (s): 40

Extended reflow time ensures proper soldering and improves manufacturing yield.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability guarantees secure solder joints and overall robustness.

Length: 7 mm

Compact length provides a space-saving solution for applications with size constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable and stable operation in harsh environmental conditions.

No. of Channels: 10

Multiple channels for power management offer versatility and scalability for various applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures compatibility with lead-free soldering processes.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, maximizing PCB real estate utilization.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates resistance to moisture-related reliability issues, suitable for diverse environments.

Maximum Supply Voltage (Vsup): 4.5 V

High maximum voltage rating enables compatibility with a wide range of power sources, increasing flexibility.

Adjustable Threshold: YES

Adjustable threshold feature allows for customization and optimization of power management operations, enhancing performance.

Technical Specifications

Power Management ICs MC34PF3001A3EP attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Additional Features:

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7 mm

Trade Compliance

MC34PF3001A3EP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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