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MC34PF3001A1EPR2

NXP Semiconductors

MC34PF3001A1EPR2 by NXP Semiconductors

MC34PF3001A1EPR2 by NXP Semiconductors is a Power Management IC with 48 terminals, operating at -40 to 105°C. It supports 10 channels, has a supply voltage range of 2.8-4.5V, and features adjustable threshold levels. Ideal for industrial applications requiring precise power supply support circuits in compact square chip carrier packages.

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Aztec Data Supply Inc.

USA . 3,861 parts In-Stock

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AZTECH Wire

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the MC34PF3001A1EPR2 by NXP Semiconductors. Designed for seamless integration in various applications, this Power Management IC offers unparalleled quality and reliability. With a wide range of benefits such as adjustable threshold and industrial-grade temperature tolerance, customers can trust in the superior performance of this product. Experience the convenience of surface mount packaging and the advanced features that make the MC34PF3001A1EPR2 a must-have solution for all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, saving time and cost in manufacturing.

Nominal Supply Voltage (Vsup): 3.6 V

Optimal supply voltage for power management applications, providing stable and efficient performance.

Maximum Operating Temperature: 105 °C

Wide maximum operating temperature range ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for use in extreme cold environments without impacting functionality.

No. of Channels: 10

Multiple channels allow for versatile power management capabilities, suitable for complex systems.

Technical Specifications

Power Management ICs MC34PF3001A1EPR2 attributes and parameters. Explore more Power Management ICs devices from NXP Semiconductors

Specs

Additional Features:

OTHER SUPPLY VOLTAGE=3.7 V TO 5.5 V

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

10

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

7 mm

Trade Compliance

MC34PF3001A1EPR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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